Method of manufacturing light emitting device

A method of manufacturing a light emitting device comprising:

• providing a package having side walls which define a recess;
• disposing a light emitting element in the recess;
• injecting a sealing material in the recess of the package, the sealing material including fluorescent material particles and a binder, the fluorescent material particles including particles of fluoride fluorescent material that include a surface region and an inner region, both the surface region and the inner region having a composition including:
• tetravalent manganese ions,
• at least one element or compound selected from the group consisting of alkali metal elements and NH4+, and
• at least one element selected from the group consisting of Group 4 elements and Group 14 elements;
• sedimenting centrifugally the fluorescent material particles toward a bottom surface in the recess to form a sealing member that comprises a first sealing member portion and a second sealing member portion,
• the first sealing member portion covering the light emitting element, and comprising a first binder portion and the fluorescent material particles located in the first binder portion, and
• the second sealing member portion covering the first sealing portion, and comprising a second binder portion and substantially no fluorescent material particles located in the second binder portion;
• and
• curing the binder to form a cured sealing member,
• wherein a tetravalent manganese ion concentration of the surface region of the particles of fluoride fluorescent material is lower than a tetravalent manganese ion concentration of the inner region of the particles of fluoride fluorescent material.