Method for producing a plurality of optoelectronic components and optoelectronic component
AssigneeOSRAM Opto Semiconductors GmbH
InventorsTony Albrecht, Thomas Schlereth, Albert Schneider
Life of this patent
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Abstract
The invention relates to a method for producing a plurality of optoelectronic components, comprising the following steps: —providing an auxiliary support wafer (1) having contact structures (4), wherein the auxiliary support wafer comprises glass, sapphire, or a semiconductor material, —applying a plurality of radiation-emitting semiconductor bodies (5) to the contact structures (4), —encapsulating an least the contact structures (4) with a potting mass (10), and —removing the auxiliary support wafer (1). The invention further relates to an optoelectronic component.
Claims15
A method for producing a plurality of optoelectronic components having the following steps:
- providing an auxiliary carrier wafer having contact structures;
- applying a plurality of radiation-emitting semiconductor bodies to the contact structures;
- encapsulating the contact structures with a mechanically stabilizing material which terminates flush with a surface of the contact structures, the mechanically stabilizing material being a housing material;
- applying a potting mass to the surface, which is formed by the contact structures and the mechanically stabilizing material, such that the potting mass terminates flush with a front side of the semiconductor bodies;
- and
- removing the auxiliary carrier wafer.
A method for producing a plurality of optoelectronic components having the following steps:
- providing an auxiliary carrier wafer having contact structures;
- applying a plurality of radiation-emitting semiconductor bodies to the contact structures;
- encapsulating the contact structures with a mechanically stabilizing material which terminates flush with a surface of the contact structures, the mechanically stabilizing material being a housing material;
- applying a reflective potting mass to the surface, which is formed by the contact structures and the mechanically stabilizing material, such that the potting mass terminates flush with a front side of the semiconductor bodies;
- and
- removing the auxiliary carrier wafer.
Dependencies are inferred from the claim text.