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US 9,755,108 B2Granted
Light emitting device and method for manufacturing light emitting device
AssigneeToyoda Gosei Co., Ltd.
InventorsSatoshi Wada, Yoshiki Taniyama
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Abstract
A light emitting device includes: a semiconductor light emitting element having a sapphire substrate and a semiconductor layer; a mounting board; and a light transmission member, wherein: the sapphire substrate is bonded to the light transmission member by an adhesive material; the semiconductor light emitting element is mounted on the mounting board in the form of a flip-chip; and a roughened peripheral edge part is formed in the sapphire substrate in the mounting board side.
Claims11
A light emitting device, including:
- a semiconductor light emitting element comprising a sapphire substrate and a semiconductor layer;
- a mounting board;
- and
- a light transmission member,
- wherein the sapphire substrate is bonded to the light transmission member by an adhesive material,
- wherein the semiconductor light emitting element is mounted on the mounting board in a form of a flip-chip,
- wherein a roughened peripheral edge part is formed in the sapphire substrate in a mounting board side,
- wherein the roughened peripheral edge part is formed in such a way that a side surface of the sapphire substrate in the mounting board side is roughened, and
- wherein the sapphire substrate includes the roughened peripheral edge part, a wall opening part, and a laser beam machined surface, in order from the mounting board side.
6 more elements
A light emitting device, including:
- a semiconductor light emitting element comprising a sapphire substrate and a semiconductor layer;
- a mounting board;
- and
- a light transmission member,
- wherein the sapphire substrate is bonded to the light transmission member by an adhesive material,
- wherein the semiconductor light emitting element is mounted on the mounting board in a form of a flip-chip,
- wherein a roughened peripheral edge part is formed in the sapphire substrate in a mounting board side, and
- wherein the roughened peripheral edge part is coated with a material lower in its wettability than that of the sapphire substrate.
5 more elements
Dependencies are inferred from the claim text.