Packaging module and substrate structure thereof

Abstract

A substrate structure is provided, including a first insulating layer, a first circuit layer embedded in and bonded to the first insulating layer; a plurality of first conductive posts formed in the first insulating layer and electrically connected to the first circuit layer, a second circuit layer formed on the first insulating layer and electrically connected to the first circuit layer through the first conductive posts, a plurality of second conductive posts and a plurality of conductive bumps formed on the second circuit layer, and a second insulating layer formed on the first insulating layer and encapsulating the second circuit layer, the second conductive posts and the conductive bumps. The second insulating layer has a cavity exposing the conductive bumps. When the substrate structure is applied to a camera lens, a sensor element can be disposed in the cavity to reduce the thickness of the overall packaging module.

Dependencies are inferred from the claim text.