SMD, IPD, and/or wire mount in a package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsien-Wei Chen, Ming-Yen Chiu
Life of this patent
Estimating the term…
Abstract
Various package structures and methods of forming package structures are described. According an embodiment, a structure includes a first package and a package component attached to the first package by external connectors. The first package comprises a device attached to a first pad and a second pad. The device is a surface mount device (SMD), an integrated passive device (IPD), or a combination thereof. The device is attached to the first pad and the second pad through a dielectric layer. A spacer material is disposed laterally between the first pad and the second pad and is disposed between the device and the dielectric layer. An encapsulant surrounds the device and the spacer material.
Claims19
A structure comprising:
- a first package comprising a device attached to a first pad and a second pad, the device being a surface mount device (SMD), an integrated passive device (IPD), or a combination thereof, the device being attached to the first pad and the second pad through a dielectric layer, a first spacer material being disposed directly between the first pad and the second pad and disposed between the device and the dielectric layer, an encapsulant surrounding the device and the first spacer material, wherein a sidewall of the first spacer material facing the first pad is a point of the first spacer material that is located furthest from a center of the first spacer material in a cross-sectional view, wherein the first spacer material is separated from both the first pad and the second pad by the dielectric layer;
- and
- a package component attached to the first package by external connectors.
A structure comprising:
- a first package comprising:
- an integrated circuit die at least laterally encapsulated with a first encapsulant, wherein the encapsulant comprises a first material throughout the encapsulant and the first material is planar with a connector connected to the integrated circuit die;
- a redistribution structure on the integrated circuit die and the first encapsulant, the redistribution structure comprising a first pad, a second pad, and a dielectric layer;
- and
- a device attached through the dielectric layer to the first pad and the second pad, the device being a surface mount device (SMD), an integrated passive device (IPD), or a combination thereof, a recess being in the dielectric layer between the first pad and the second pad, wherein the first pad and the second pad have a dimension in a plane parallel to a major surface of the dielectric layer and in a first direction perpendicular to a second direction, the second direction being from the first pad to the second pad, the recess having a length in the plane and in the first direction, the length being greater than the dimension.
A structure comprising:
- openings through a dielectric layer, wherein the openings expose a first pad and a second pad, the dielectric layer being in a redistribution structure in a first package;
- a first spacer material on the dielectric layer between the first pad and the second pad, wherein the first spacer material does not extend beyond the first pad and the second pad in a first direction parallel with a top surface of the first pad, wherein the first spacer material is located within a recess, the recess being within the dielectric layer separate from the openings;
- and
- a device attached to the first pad and the second pad, the device being a surface mount device (SMD), an integrated passive device (IPD), or a combination thereof, the first spacer material being disposed between the device and the dielectric layer.
Dependencies are inferred from the claim text.