Method of forming wafer-level molded structure for package assembly
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTsung-Ding Wang, Bo-I Lee, Chien-Hsun Lee
Life of this patent
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Abstract
A method of forming an integrated circuit structure is provided. In an embodiment, the method includes bonding top dies onto a bottom wafer and then molding a first molding material onto and in between the top dies and the bottom wafer. The bottom wafer, the top dies, and the first molding material are sawed to form molding units. Each of the molding units includes one of the top dies and a bottom die sawed from the bottom wafer. The molding units are bonded onto a package substrate and a second molding material is molding onto the one of the molding units and the package substrate. Thereafter, the package substrate and the second molding material are sawed to form package-molded units.
Claims20
A method of forming an integrated circuit structure, the method comprising:
- attaching a bottom die to a carrier using an adhesive;
- bonding a top die onto the bottom die such that the bottom die is interposed between the top die and the carrier;
- forming a first molding material onto and between the top die and the bottom die;
- after forming the first molding material, removing the carrier from the bottom die;
- and
- bonding a package substrate to the bottom die such that the bottom die is interposed between the top die and the package substrate, the bottom die being electrically coupled to the package substrate, the first molding material being in contact with edges of the top die and having edges vertically aligned with respective edges of the bottom die while bonding the package substrate to the bottom die.
A method of forming an integrated circuit structure, the method comprising:
- attaching a bottom die to a carrier using an adhesive;
- bonding a top die onto the bottom die such that the bottom die is interposed between the top die and the carrier;
- forming a first molding material onto and between the top die and the bottom die;
- after forming the first molding material, removing the carrier from the bottom die;
- bonding a package substrate to the bottom die such that the bottom die is interposed between the top die and the package substrate, the bottom die being electrically coupled to the package substrate, the first molding material being in contact with edges of the top die and having edges vertically aligned with respective edges of the bottom die while bonding the package substrate to the bottom die;
- and
- after bonding the package substrate to the bottom die, forming a second molding material over the package substrate, the second molding material extending along sidewalls of the bottom die, sidewalls of the first molding material, and over a top surface of the top die, at least a portion of the first molding material being interposed between the top surface of the top die and the second molding material.
Dependencies are inferred from the claim text.