Semiconductor device manufacturing method
AssigneeRenesas Electronics Corporation
InventorKazuhiko Okishima
Life of this patent
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Abstract
In wire bonding in assembling of a semiconductor device, an Al wire is coupled to a lead section by a wedge which is a bonding tool, thereafter, the wedge is withdrawn from the top of the lead section and a cutter is lowered and the Al wire is cut off in this state. Lowering of the cutter is stopped at a point in time that a stopper which is lowered simultaneously with lowering of the cutter has truck against the lead section and cutting of the Al wire is terminated by stopping of lowering of the cutter.
Claims15
A semiconductor device manufacturing method, comprising the steps of:
- (a) preparing a lead frame which includes a chip mounting section and a plurality of lead sections arranged around the chip mounting section;
- (b) after the step (a), mounting a semiconductor chip which includes a plurality of electrode pads on the chip mounting section of the lead frame;
- and
- (c) after the step (b), electrically coupling together the electrode pads of the semiconductor chip and the lead sections individually by a plurality of Al wires,
- wherein the step (c) includes the steps of
- (c1) electrically coupling together each electrode pad of the semiconductor chip and each Al wire by a wedge as a bonding tool,
- (c2) after the step (c1), pressing the Al wire against the lead section by the wedge and thereby electrically coupling together the Al wire and the lead section, and
- (c3) after the step (c2), lowering a cutter member and cutting the Al wire by the cutter member in a state of leaving the wedge withdrawn from the top of the lead section and terminating cutting of the Al wire by the cutter member at a point in time that a stopper member which is lowered in accordance with lowering of the cutter member has struck against the lead section.
A semiconductor device manufacturing method, comprising the steps of:
- (a) preparing a lead frame which includes a chip mounting section and a plurality of lead sections arranged around the chip mounting section;
- (b) after the step (a), mounting a semiconductor chip which includes a plurality of electrode pads on the chip mounting section of the lead frame;
- and
- (c) after the step (b), electrically coupling together the electrode pads of the semiconductor chip and the lead sections individually by a plurality of Al wires,
- wherein the step (c) includes the steps of
- (c1) electrically coupling together each electrode pad of the semiconductor chip and each Al wire by a wedge as a bonding tool,
- (c2) after the step (c1), pressing the Al wire against the lead section by the wedge and thereby electrically coupling together the Al wire and the lead section, and
- (c3) after the step (c2), lowering a cutter member which is attached to a drive section which is the same as that for the wedge and cutting the Al wire by the cutter member in a state of leaving the wedge withdrawn from the top of the lead section and terminating cutting of the Al wire by the cutter member at a point in time that a stopper member which is lowered in accordance with lowering of the cutter member has struck against the lead section.
Dependencies are inferred from the claim text.