Integrated circuit package
AssigneeSencio B.V.
InventorJurgen Leonardus Theodorus Maria Raben
Life of this patent
Estimating the term…
Abstract
Integrated circuit package including an integrated circuit, external connection elements (3) connected to the integrated circuit, a package material (2) enclosing the integrated circuit, and a mechanical element (5, 6, 7) allowing a mechanical connection of a further element to the integrated circuit package (1). The mechanical element (5, 6, 7) is e.g. an attachment element (5); a mechanical element (5), optionally with a thread; a bushing element; a bearing element (7); an electrical connector (6).
Claims15
An integrated circuit package comprising an integrated circuit, external connection elements connected to the integrated circuit, a package material enclosing the integrated circuit, and a mechanical element allowing a mechanical connection of a further element to the integrated circuit package, wherein the mechanical element is an attachment element of a thermoplast material, partly exposed from the integrated circuit package.
An integrated circuit package comprising an integrated circuit, external connection elements connected to the integrated circuit, a package material enclosing the integrated circuit, and a mechanical element allowing a mechanical connection of a further element to the integrated circuit package, wherein the mechanical element is a bearing element, and the integrated circuit package further comprising a sensor inside the package, an external connection axis supported by the bearing element, and a sensor activation element attached to the external connection axis.
An integrated circuit package comprising an integrated circuit, external connection elements connected to the integrated circuit, a package material enclosing the integrated circuit, and a mechanical element allowing a mechanical connection of a further element to the integrated circuit package, wherein the integrated circuit package further comprises a sensor element electrically connected to the integrated circuit, and the mechanical element is not providing an external communication channel to the sensor element.
Dependencies are inferred from the claim text.