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US 9,754,912 B2Granted
Electronic device and method for production
AssigneeInfineon Technologies AG
InventorsKhalil Hosseini, Matthias Stecher
Life of this patent
Estimating the term…
Abstract
An electronic device and method for production is disclosed. One embodiment provides an integrated component having a first layer which is composed of copper or a copper alloy or which contains copper or a copper alloy, and having an electrically conductive second layer, whose material differs from the material of the first layer, and a connection apparatus which is arranged on the first layer and on the second layer.
Claims20
A method of forming a connecting apparatus for an electronic device comprising:
- forming a metallization stack including:
- forming a first layer comprising copper;
- forming a barrier layer on the first layer, the barrier layer being thinner than the first layer;
- and
- forming a second layer on a major surface of the barrier layer such that the barrier layer is arranged between the first layer and the second layer, the second layer being a material different from a material of the first layer;
- and
- connecting a copper bonding wire to the metallization stack, the copper bonding wire passing through the second layer and being directly connected to both the second layer and the major surface of the barrier layer.
4 more elements
A method of producing an electronic device comprising:
- forming a metallization stack including:
- forming a first layer comprising copper;
- forming a first protective layer on the first layer using a material different from a material of the first layer;
- and
- forming a second protective layer on a major surface of the first protective layer, the material of the second layer being different from the material of both the first protective layer and the first layer;
- attaching a copper bonding wire to the second protective layer, the copper bonding wire extending through the second protective layer and being directly connected to the major surface of the first protective layer;
- and
- forming a housing body of polymer material about the copper bonding wire and the metallization stack.
5 more elements
Dependencies are inferred from the claim text.