Methods of packaging semiconductor devices and packaged semiconductor devices
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJie Chen, Hsien-Wei Chen
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Abstract
Methods of packaging semiconductor devices and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes providing a semiconductor device comprising an integrated circuit die, connectors disposed over the integrated circuit die, and an insulating material disposed over the connectors and the integrated circuit die. The insulating material is removed from over corner regions of the integrated circuit die, and a molding material is disposed over the insulating material and the integrated circuit die. A top portion of the molding material and the insulating material is removed to expose the connectors.
Claims20
A method of packaging a semiconductor device, the method comprising:
- providing a semiconductor device comprising an integrated circuit die, a plurality of connectors disposed over the integrated circuit die, and an insulating material disposed over the plurality of connectors and the integrated circuit die;
- removing the insulating material from over corner regions of the integrated circuit die;
- after removing the insulating material, disposing a molding material over the insulating material and the integrated circuit die;
- and
- removing a top portion of the molding material and the insulating material to expose the plurality of connectors.
A method of packaging a semiconductor device, the method comprising:
- providing a wafer including a plurality of integrated circuit dies, a plurality of connectors disposed over the plurality of integrated circuit dies, and an insulating material disposed over the plurality of connectors and the plurality of integrated circuit dies;
- removing the insulating material from corner regions of the plurality of integrated circuit dies using a photolithography process;
- singulating the plurality of integrated circuit dies;
- coupling one of the plurality of integrated circuit dies to a carrier;
- after removing the insulating material from corner regions, disposing a molding material over the insulating material, the one of the plurality of integrated circuit dies, and portions of the carrier;
- and
- removing a top portion of the molding material and the insulating material to expose the plurality of connectors.
A packaged semiconductor device, comprising:
- an integrated circuit die including a plurality of connectors disposed thereon;
- an insulating material disposed between the plurality of connectors over the integrated circuit die, wherein the insulating material is not disposed in corner regions of the integrated circuit die;
- a molding material disposed around the integrated circuit die and over the corner regions of the integrated circuit die, the insulating material interposed between the molding material and the integrated circuit die;
- and
- an interconnect structure disposed over the plurality of connectors, the insulating material, and the molding material.
Dependencies are inferred from the claim text.