Double plated conductive pillar package substrate
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsLi-Chuan Tsai, Chih-Cheng Lee
Life of this patent
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Abstract
The present disclosure relates to a package substrate. The package substrate includes a patterned conductive layer and conductive pillars. Each of the conductive pillars includes a first portion and a second portion, where the first portion contacts the patterned conductive layer at one end of the first portion, and the second portion is adjacent to another end of the first portion. A thickness of the first portion is greater than a thickness of the second portion. Side surfaces of the first portion are substantially coplanar to side surfaces of the second portion.
Claims20
A package substrate, comprising:
- a patterned conductive layer;
- and
- a plurality of conductive pillars, wherein each of the conductive pillars includes:
- a first portion, having a first thickness, with one end contacting the patterned conductive layer, and
- a second portion, having a second thickness that is less than the first thickness, adjacent to another end of the first portion, the second portion including a first sub-portion and a second sub-portion, wherein the second portion includes corners between the first sub-portion and the second sub-portion;
- wherein side surfaces of the first portion are substantially coplanar to side surfaces of the second portion, and
- wherein a combined thickness of the first portion and the second portion is about 50 μm to about 150 μm.
A semiconductor packaging structure, comprising:
- a first substrate including a plurality of first pads and a plurality of second pads;
- a first semiconductor device positioned on the first substrate and electrically connected to the first pads;
- and
- a second substrate, including:
- a first patterned conductive layer;
- and
- a plurality of conductive pillars, wherein each of the conductive pillars includes:
- a first portion, having a first thickness, with one end contacting the patterned conductive layer, and
- a second portion, having a second thickness less than the first thickness, a first end of the second portion adjacent to another end of the first portion, the second portion including a first sub-portion and a second sub-portion, wherein the second portion includes corners between the first sub-portion and the second sub-portion,
- wherein side surfaces of the first portion are substantially coplanar to side surfaces of the second portion, and
- wherein the conductive pillars surround the semiconductor device and a second end of the second portion of each of the conductive pillars is connected to one of the second pads,
- wherein a combined thickness of the first portion and the second portion of each of the conductive pillars is about 50 μm to about 150 μm.
A semiconductor packaging structure, comprising:
- a first substrate;
- a second substrate;
- and
- a conductive pillar extending between the first substrate and the second substrate, wherein the conductive pillar includes:
- a first portion, having a first thickness, adjacent to the first substrate,
- a second portion, having a second thickness that is less than the first thickness, adjacent to the second substrate, the second portion including a first sub-portion and a second sub-portion, wherein the second portion includes corners between the first sub-portion and the second sub-portion;
- and
- a seed layer disposed between the first portion and the second portion,
- wherein a side surface of the first portion is substantially coplanar to a side surface of the second portion,
- wherein a combined thickness of the first portion and the second portion is about 50 μm to about 150 μm.
Dependencies are inferred from the claim text.