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US 9,754,904 B2Granted
Electronic apparatus and method for manufacturing electronic apparatus
AssigneeFujitsu Limited
InventorsMasaru Morita, Nobuhiro Imaizumi
Life of this patent
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Abstract
An electronic apparatus includes: a first substrate; an electrode over the first substrate; a first conductor having a porous structure above the first substrate, the first conductor covering an upper surface and a side surface of the electrode; and an insulator above the first substrate, the insulator covering an upper surface and a side surface of the first conductor, wherein the insulator has an opening that exposes the first conductor.
Claims15
An electronic apparatus comprising:
- a first substrate;
- an electrode over the first substrate;
- a first conductor having a porous structure above the first substrate, the first conductor covering an upper surface and a side surface of the electrode;
- and
- an insulator above the first substrate, the insulator covering an upper surface and a side surface of the first conductor,
- wherein the insulator has an opening that exposes the first conductor.
3 more elements
A method for manufacturing an electronic apparatus, comprising:
- forming an electrode above a first substrate;
- forming a first conductor having a porous structure above the first substrate, the first conductor covering an upper surface and a side surface of the electrode;
- forming an insulator above the first substrate, the insulator covering an upper surface and a side surface of the first conductor;
- and
- forming an opening in the insulator, the opening exposes the first conductor.
2 more elements
Dependencies are inferred from the claim text.