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US 9,754,899 B2Granted
Semiconductor structure and method of fabricating the same
AssigneeAdvanpack Solutions Pte Ltd.
InventorsShoa Siong Raymond Lim, Hwee Seng Jimmy Chew
Life of this patent
Estimating the term…
Abstract
A semiconductor structure and a method of fabricating the same. The semiconductor structure comprises: a layer element, one or more supporting elements disposed on a first surface of the layer element, and one or more anchoring elements disposed within the layer element and connected to the one or more supporting elements to couple the one or more supporting elements to the layer element to strengthen the layer element.
Claims23
A semiconductor structure, comprising:
- A discontinuous layer element comprising two or more discrete sections;
- one or more supporting elements disposed on a first surface of the layer element wherein one supporting element is disposed across each gap between adjacent discrete sections of the layer element;
- and
- two or more anchoring elements disposed within the layer element and connected to the one or more supporting elements to couple the one or more supporting elements to the layer element to strengthen the layer element,
- wherein each of the two or more anchoring elements comprises an upper section and a lower section,
- wherein, relative to the lower section, the upper section has a larger cross-sectional area in a plane parallel to the first surface of the layer element, the upper section being connected to the one or more supporting elements.
3 more elements
A method of fabricating a semiconductor structure, the method comprising:
- forming two or more anchoring elements over a carrier such that each of the two or more anchoring elements comprises an upper section and a lower section, and such that, relative to the lower section, the upper section has a larger cross-sectional area in a plane parallel to the first surface of the layer element;
- encapsulating the two or more anchoring elements within a discontinuous layer element comprising two or more discrete sections;
- and
- selectively etching the carrier to form one or more supporting elements such that the one or more supporting elements are connected to the upper section of the respective two or more anchoring elements and one supporting element is disposed across each gap between adjacent discrete sections of the layer element.
1 more element
Dependencies are inferred from the claim text.