Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits

A method of making a semiconductor device, comprising:

• providing a first component;
• disposing an encapsulant over the first component;
• forming a first interconnect structure over the first component and encapsulant;
• forming a shielding layer over the first component, encapsulant, and first interconnect structure;
• and
• singulating the semiconductor device with a width of the first interconnect structure greater than a width of the shielding layer.

A semiconductor device, comprising:

• a first component;
• a passive device disposed adjacent to the first component;
• a modular interconnect structure disposed adjacent to the first component;
• a first interconnect structure formed over the first component and modular interconnect structure;
• and
• a shielding layer formed over the first component, modular interconnect structure, and first interconnect structure.

A semiconductor device, comprising:

• a first component;
• an encapsulant disposed over the first component;
• a conductive layer disposed over the encapsulant and including a surface coplanar with a side surface of the encapsulant;
• a first interconnect structure formed over the first component, conductive layer, and encapsulant;
• and
• a shielding layer formed over the first component, encapsulant, and first interconnect structure and contacting the conductive layer.