Systems and methods for providing electromagnetic interference shielding for integrated circuit modules

A method to provide at least part of an electromagnetic interference or radio frequency interference shield that attenuates electromagnetic interference or radio frequency interference during operation of an integrated circuit module, the method comprising:

• forming at least one wirebond around a perimeter of each integrated circuit module of a plurality of integrated circuit modules formed on a panel;
• forming an overmold over the panel such that an upper portion of the at least one wirebond of each integrated circuit module is exposed;
• controlling a first set of parameters of a spray apparatus based at least in part on viscosity of a conductive paint and a size of metal particles in the conductive paint;
• determining a second set of parameters, the second set of parameters based at least in part on at least one of the first set of parameters;
• automatically spraying a plurality of separate perimeter bands of the conductive paint onto a perimeter of the panel such that the perimeter bands do not overlap and so an entire width of each of the separate bands is sprayed inward of an outer perimeter edge of the panel to avoid overspray;
• automatically spraying the conductive paint from the spray nozzle to form N axially elongate first bands of the conductive paint and N+1 axially elongate second bands of the conductive paint along a longitudinal axis of the panel, the N axially elongate first bands separated by a first distance from one another and the N+1 axially elongate second bands separated by a second distance from one another, the N axially elongate first bands and N+1 axially elongate second bands being sprayed inward of the plurality of separate perimeter bands to avoid overlap with the previously sprayed perimeter bands, the N+1 axially elongate second bands being sprayed after spraying the N axially elongate first bands and such that the N+1 axially elongate second bands interleave the N axially elongate first bands to provide an approximately uniform layer of the conductive paint over at least a portion of the upper surface of the panel while at the same time avoiding overspray, the layer of the conductive paint electrically coupling with the at least one wirebond of at least one integrated circuit module of the plurality of integrated circuit modules to form at least part of an electromagnetic interference or radio frequency interference shield;
• and
• automatically spraying a second plurality of separate perimeter bands of the conductive paint onto the perimeter of the panel after automatically spraying the N axially elongate fist bands and before automatically spraying the N+1 axially elongate second bands such that the second plurality of separate perimeter bands do not overlap and so an entire width of each of the second plurality of separate perimeter bands is sprayed inward of an outer perimeter edge of the panel to avoid overspray.