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US 9,754,894 B2Granted
Sheet for sealing and method for manufacturing semiconductor device using said sheet for sealing
AssigneeNitto Denko Corporation
InventorsChie Iino, Takeshi Matsumura, Goji Shiga, Kosuke Morita
Life of this patent
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Abstract
Provided is a thermosetting sheet for sealing which is used to seal an electronic device. One surface of the sheet has a surface roughness (Ra) of 3 μm or less before the sheet is cured.
Claims3
A sheet for sealing, which is a thermosetting sheet used to seal an electronic device,
- one surface of the sheet having a surface roughness (Ra) of 3 μm or less,
- wherein a colorant is added to the side of the one surface of the sheet.
A method for manufacturing a semiconductor device, comprising:
- a step A of flip-chip bonding an electronic device onto a circuit-forming surface of a semiconductor wafer, and
- a step B of embedding the electronic device flip-chip bonded onto the semiconductor wafer into a sheet for sealing to form a sealed body,
- wherein a surface of the sheet for sealing, the surface being opposite to a surface of the sheet that faces the semiconductor wafer, has a surface roughness (Ra) of 3 μm or less.
Dependencies are inferred from the claim text.