Integrated circuitry

Integrated circuitry comprising:

• a first dielectric layer;
• a first conductive line within the first dielectric layer, the first dielectric layer having an uppermost surface, the first conductive line comprising a conductive outer lining and a central material of different composition from that of the conductive outer lining, the conductive outer lining and the central material having respective uppermost surfaces that are elevationally coincident with each other and with the uppermost surface of the first dielectric layer;
• a first tungsten layer over and in direct contact with the uppermost surfaces of the conductive outer lining and the central material of the first conductive line, the first tungsten layer being everywhere elevationally outward of the first dielectric layer;
• a second dielectric layer covering the first dielectric layer and the first tungsten layer;
• a via in the second dielectric layer extending to a part of the first tungsten layer, the second dielectric layer including a side surface extending there-through which defines the via;
• a conductive liner layer covering over the part of the first tungsten layer and covering over the side surface of the second dielectric layer and which less-than-fills a central portion of the via;
• a second tungsten layer of different composition from the conductive liner filling the central portion of the via;
• and
• the conductive liner layer and the second tungsten layer being elongated over the second dielectric layer to form a second conductive line, the conductive liner being between the second tungsten layer and the second dielectric layer in a finished construction of the integrated circuitry.