Switch circuit package module

A switch circuit package module, comprising:

• at least a semiconductor switch unit comprising:
• a first semiconductor switch element comprising a plurality of parallel connected sub micro-switch elements, each sub micro-switch element configured with a drain electrode and a source electrode;
• and
• a second semiconductor switch element comprising a plurality of parallel connected sub micro-switch elements, each sub micro-switch element configured with a drain electrode and a source electrode;
• and
• at least a capacitor unit comprising a plurality of capacitors;
• wherein the semiconductor switch unit comprises a plurality of common electrodes, each common electrode connects the source electrode of one sub micro-switch element in the first semiconductor switch element with the drain electrode of one sub micro-switch element in the second semiconductor switch element, such that when the capacitors are configured to cooperate with the sub micro-switch element, impedances of multiple commutation loops between the capacitors and the sub micro-switch element are close to or the same with each other, each of the common electrodes is arranged between the drain electrode of the first semiconductor switch element and the source electrode of the second semiconductor switch element, each of the drain electrodes of the first semiconductor switch element and each of the source electrodes of the second semiconductor switch element are arranged alternately.