Light emitting semiconductor device and substrate therefore
Assignee3M Innovative Properties Company
InventorsAlejandro Aldrin II Agcaoili Narag, Ravi Palaniswamy, Bee Leng Tan, Antonny Enojo Flor
Life of this patent
Estimating the term…
Abstract
Provided is an article for supporting an LESD comprising a dielectric layer having a first major surface with a conductive layer thereon and a second major surface, the dielectric layer having at least three vias extending from the second major surface to the first major surface, the conductive layer comprising at least first and second conductive features, wherein the first conductive feature is adjacent an opening of at least a first via and the second conductive feature is adjacent an opening of at least a second and a third via.
Claims18
A support article comprising:
- a dielectric layer having a first major surface with a conductive layer thereon and a second major surface, the dielectric layer having at least three vias extending from the second major surface to the first major surface, the conductive layer comprising at least first and second conductive features, wherein the first conductive feature is adjacent an opening of at least a first via and the second conductive feature is adjacent an opening of at least a second and a third via and wherein the via openings at the second surface are larger than the via openings at the first surface, wherein the at least three vias contain conductive material, and wherein the conductive material in at least one of the vias extends beyond the second surface of the dielectric layer.
Dependencies are inferred from the claim text.