Substrate structure, electronic package and method for fabricating the electronic package
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsChing-Wen Chiang, Hsin-Chih Wang, Chih-Yuan Shih, Shih-Ching Chen
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Abstract
A substrate structure is provided, which includes: a substrate body having a first surface and a second surface opposite to the first surface; and a plurality of conductive posts disposed on the first surface of the substrate body and electrically connected to the substrate body. By replacing conventional through silicon vias (TSVs) with the conductive posts, the present disclosure greatly reduces the fabrication cost. The present disclosure further provides an electronic package having the substrate structure and a method for fabricating the electronic package.
Claims6
An electronic package, comprising:
- a substrate body having a first surface and a second surface opposite to the first surface;
- a plurality of conductive posts disposed on and protruding from the first surface of the substrate body and electrically connected to the substrate body, wherein a side of each of the conductive posts has an insulating layer, and any two adjacent ones of the insulating layers of the conductive posts have an air gap formed therebetween;
- at least an electronic element disposed on the second surface of the substrate body and electrically connected to the substrate body;
- and
- an encapsulant formed on the second surface of the substrate body and encapsulating the electronic element.
A substrate structure, comprising:
- a substrate body having a first surface and a second surface opposite to the first surface;
- a plurality of conductive posts disposed on and protruding from the first surface of the substrate body and electrically connected to the substrate body, wherein a side of each of the conductive posts has an insulating layer, and any two adjacent ones of the insulating layers of the conductive posts have an air gap formed therebetween.
Dependencies are inferred from the claim text.