Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package

A method of making a semiconductor device, comprising:

• providing a semiconductor die;
• forming a compliant island over the semiconductor die;
• forming an insulating layer over the compliant island with a surface of the insulating layer substantially planar over an entire width of the compliant island;
• and
• forming an interconnect structure over the semiconductor die and aligned with the compliant island.

A semiconductor device, comprising:

• a semiconductor die;
• a compliant island formed over the semiconductor die;
• a conductive via formed through the compliant island;
• and
• an interconnect structure formed over the compliant island and coupled to the semiconductor die through the conductive via.

A semiconductor device, comprising:

• a semiconductor die;
• a compliant island over the semiconductor die, wherein the compliant island extends outside a footprint of the semiconductor die;
• and
• an interconnect structure over the compliant island.