Semiconductor power device having single in-line lead module and method of making the same

A semiconductor power device comprising:

• a lead frame unit having a top surface and a bottom surface opposite the top surface;
• two or more pluralities of single in-line leads arranged in a row near a side of the lead frame unit;
• two or more semiconductor chip stacks each including
• a high-side semiconductor chip having a top surface and a bottom surface, the bottom surface of the high-side semiconductor chip being attached to the top surface of the lead frame unit through a first layer of conductive bonding material;
• a first clip having a first end and a second end, a bottom surface of the first end of the first clip being attached to a source pad on the top surface of the high-side semiconductor chip through a second layer of conductive bonding material, and a bottom surface of the second end of the first clip being attached to a top surface of a first lead of a respective plurality of single in-line leads of the two or more pluralities of single in-line leads through a third layer of conductive bonding material;
• and
• a low-side semiconductor chip having a top surface and a bottom surface, the bottom surface of the low-side semiconductor chip being attached to the top surface of the first end of the first clip through a fourth layer of conductive bonding material;
• and
• a molding encapsulation;
• wherein a source pad on the top surface of the low-side semiconductor chip of said each of the two or more semiconductor chip stacks is electrically and mechanically connected to ground;
• and
• wherein the high-side and low-side semiconductor chips and the first clip of said each of the two or more semiconductor chip stacks and at least a majority portion of the lead frame unit are embedded in the molding encapsulation.