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US 9,754,862 B2Granted
Compound semiconductor device including a multilevel carrier
AssigneeInfineon Technologies Austria AG
InventorsRalf Otremba, Klaus Schiess
Life of this patent
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Abstract
A device includes a carrier having a first carrier section on a first level and a second carrier section on a second level different from the first level. The device further includes a compound semiconductor chip arranged over the first carrier section and a control semiconductor chip arranged over the second carrier section. The control semiconductor chip is configured to control the compound semiconductor chip. An encapsulation material covers the compound semiconductor chip and the control semiconductor chip.
Claims19
A device, comprising:
- a carrier comprising a first carrier section on a first level and a second carrier section on a second level different from the first level in a vertical direction, the first carrier section and the second carrier section being offset from one another in a horizontal direction so that the second carrier section does not cover the first carrier section;
- a compound semiconductor chip arranged over the first carrier section;
- a control semiconductor chip arranged over the second carrier section and configured to control the compound semiconductor chip;
- an encapsulation material covering the compound semiconductor chip and the control semiconductor chip;
- and
- an electrically conductive coupling element directly connecting an electrical contact arranged on a main surface of the control semiconductor chip facing away from the second carrier section to a gate electrode arranged on a main surface of the compound semiconductor chip facing away from the first carrier section.
3 more elements
A device, comprising:
- a leadframe comprising a first diepad on a first level, a second diepad on a second level,
- and a plurality of leads on a third level, wherein the three levels differ from each other in a vertical direction, wherein the first diepad and the second diepad are offset from one another in a horizontal direction so that the second diepad does not cover the first diepad;
- a compound semiconductor chip arranged over the first diepad;
- a control semiconductor chip arranged over the second diepad and configured to control the compound semiconductor chip;
- and
- an electrically conductive coupling element directly connecting an electrical contact arranged on a main surface of the control semiconductor chip facing away from the second diepad to a gate electrode arranged on a main surface of the compound semiconductor chip facing away from the first diepad,
- wherein the plurality of leads is electrically coupled to at least one of the compound semiconductor chip and the control semiconductor chip.
4 more elements
A device, comprising:
- a carrier comprising a first carrier section on a first level and a second carrier section on a second level different from the first level in a vertical direction, the first carrier section and the second carrier section being offset from one another in a horizontal direction so that the second carrier section does not cover the first carrier section;
- a compound semiconductor chip arranged over a first surface of the first carrier section;
- a control semiconductor chip arranged over the second carrier section and configured to control the compound semiconductor chip;
- an electrically conductive coupling element directly connecting an electrical contact arranged on a main surface of the control semiconductor chip facing away from the second carrier section to a gate electrode arranged on a main surface of the compound semiconductor chip facing away from the first carrier section;
- an encapsulation material covering the compound semiconductor chip and the control semiconductor chip, wherein a second surface of the first carrier section opposite the first surface is exposed from the encapsulation material;
- and
- a plurality of leads electrically coupled to at least one of the control semiconductor chip and the compound semiconductor chip, wherein the plurality of leads protrudes out of the encapsulation material, and the plurality of leads is arranged on at least one of the second level and a third level different from the first level and the second level.
4 more elements
Dependencies are inferred from the claim text.