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US 9,754,861 B2Granted
Patterned lead frame
AssigneeStmicroelectronics Pte Ltd
InventorWing Shenq Wong
Life of this patent
Estimating the term…
Abstract
A lead frame having a plurality of concentric lead frame rings configured to receive and support a variety of integrated circuit die having a variety of sizes. The rings are separated from each other by gaps and coupled together by a plurality of tie bars. The concentric rings may be circular or rectangular. The tie bars may extend diagonally from the rings or perpendicularly to the rings.
Claims16
A device, comprising:
- a lead frame having a central area, including:
- a plurality of wire bond leads at a periphery of the lead frame;
- a plurality of concentric support frames positioned centrally with respect to the plurality of wire bond leads, the plurality of concentric support frames being separated from each other by a plurality of gaps;
- and
- a plurality of tie bars fixed to and extending from the plurality of support frames towards the periphery, the plurality of concentric support frames being electrically coupled to each other by the plurality of tie bars;
- an adhesive tape positioned on the lead frame, the adhesive tape overlapping the central area and at least one gap of the plurality of gaps;
- a die positioned on the adhesive tape, the die overlapping the central area and at least one of the plurality of concentric support frames, at least one of the plurality of concentric support frames being positioned between the die and the plurality of wire bond leads;
- and
- a molding compound encapsulating the die, a portion of the molding compound filling the at east one gap, the portion of the molding compound filling the at least one gap being in contact with the adhesive tape.
6 more elements
A device, comprising:
- a plurality of wire bond leads;
- a lead frame having a central area that includes an opening, the lead frame including:
- a first, second, third, and fourth tie bar;
- a first ring positioned around the opening;
- and
- a second ring spaced from the first ring by a first gap, the second ring being separated from the central area by the first ring;
- a third ring spaced from the second ring by a second gap, the second ring being separated from the central area by the first and second rings, the first, second, and third rings being electrically coupled to each other by the first, second, third, and fourth tie bars;
- an adhesive tape positioned on the lead frame, the adhesive tape overlapping the central area, the first ring, and the second ring;
- a die positioned on the adhesive tape, the die overlapping the central area, the first ring, and the second ring, the third ring being positioned between the die and the plurality of wire bond leads;
- and
- a molding compound encapsulating the die, portions of the molding compound filling the opening and the first gap, the portions of the molding compound filling the opening and the first gap being in contact with the adhesive tape.
8 more elements
An integrated circuit package, comprising:
- a lead frame having a center, including:
- a plurality of concentric components around the center of the lead frame, a first concentric component of the plurality of concentric components being spaced from a second concentric component of the plurality of concentric components by a gap;
- a plurality of tie bars electrically coupling the plurality of concentric components to each other;
- a plurality of wire bond leads positioned outside of the plurality of concentric components of the lead frame;
- an adhesive tape positioned on the lead frame;
- a die positioned on the adhesive tape and having a first surface with a first area, a surface area of the lead frame that is facing the first surface of the die being less than the first area, at least one of the plurality of concentric components being positioned between the die and the plurality of wire bond leads;
- and
- a molding compound encapsulating the die, the gap being filled by a portion of the molding compound that contacts the adhesive tape.
5 more elements
Dependencies are inferred from the claim text.