Electronic device furnished with a conducting layer and method of fabrication

An electronic device, comprising:

• a support board having a mounting face;
• an integrated circuit chip mounted on the mounting face of the support board;
• an encapsulation block embedding the integrated circuit chip, said encapsulation block extending above the integrated circuit chip and around the integrated circuit chip on the mounting face of the support board, said encapsulation block further having a front face;
• a hole passing through the encapsulation block and uncovering at least in part an electrical contact that is located on a front face of the integrated circuit chip;
• and
• a layer made of an electrically conducting material that extends over the front face of the encapsulation block and is connected to the electrical contact in the hole.

An electronic device, comprising:

• an encapsulation block embedding an integrated circuit chip, said encapsulation block including a first opening that at least partially uncovers a first electrical contact;
• and
• a layer made of an electrically conducting material that extends over a front face of the encapsulation block and is connected to the first electrical contact in the first opening,
• wherein said first electrical contact is a contact on the integrated circuit chip.

An electronic device, comprising:

• a primary electronic device comprising a support board and an integrated circuit chip mounted on a mounting face of the support board;
• an encapsulation block encapsulating the primary electronic device and having a front face parallel to the support board, wherein said encapsulation block includes a first hole extending through the encapsulation block from said front face to at least partially uncover a first electrical contact;
• and
• a resin containing electrically conducting metallic particles in said first hole in electrical connection with the first electrical contact and extending on at least one zone of the front face of the encapsulation block.

An electronic device, comprising:

• a primary electronic device comprising a support board and an integrated circuit chip mounted on a mounting face of the support board;
• an encapsulation block encapsulating the primary electronic device and having a front face parallel to the support board, wherein said encapsulation block includes a first hole extending through the encapsulation block from said front face to at least partially uncover a first electrical contact;
• and
• an electrically conducting material in said first hole in electrical connection with the first electrical contact and extending on at least one zone of the front face of the encapsulation block;
• wherein said encapsulating block hole further comprises a second hole extending through the encapsulation block from said front face to at least partially uncover a second electrical contact;
• wherein said electrically conducting material is further in said second hole in electrical connection with the second electrical contact, and
• wherein said electrically conducting material extending on said at least one zone of the front face of the encapsulation block electrically interconnects the first and second electrical contacts.