Packaging for fingerprint sensors and methods of manufacture

A method of fabricating a biometric object sensor wafer level fan out package, the method comprising:

• forming a sensor control integrated circuit;
• forming a molded fill material to at least partially encapsulate the sensor control integrated circuit;
• forming a sensing side redistribution layer, wherein the sensing side redistribution layer is disposed on a sensing side of the package, and wherein the sensing side redistribution layer comprises at least one passivation layer and a metal layer, wherein the metal layer of the sensing side redistribution layer further comprises metal redistribution traces and a metal sensor array in the sensing side redistribution layer, the metal sensor array further including a plurality of capacitively coupled drivers and pick-ups configured to detect ridges and valleys of a fingerprint;
• forming a connection side redistribution layer, wherein the connection side redistribution layer is on an opposite side of the package relative to the sensing side;
• forming at least one ball grid array electrical connector mounted on the connection side of the package;
• and
• forming a protective coating on the sensing side of the package disposed on the sensing side redistribution layer.