Electronic device provided with an integrated conductor element and fabrication method

An electronic device, comprising:

• a primary electronic device comprising a support plate and an integrated circuit chip mounted on a mounting face of the support plate;
• a primary encapsulation block in contact with and encapsulating said primary electronic device, the primary encapsulation block having a front face parallel to the support plate;
• wherein the primary encapsulation block includes a hole extending into the primary encapsulation block from said front face to reach an electrical contact;
• a conductive element positioned such that a main portion of the conductive element extends over the front face of the primary encapsulation block and a secondary portion of the conductive element extends into said hole and is electrically connected to said electrical contact;
• and
• an additional encapsulation block in contact with the primary encapsulation block and wherein material of said additional encapsulation block fills said hole and encapsulates around the secondary portion of the conductive element.

An electronic device, comprising:

• a support plate having a mounting face with an electrical contact and including an electrical connection network connected to said electrical contact;
• an integrated circuit chip having a first face mounted on said mounting face of the support plate and linked to said electrical connection network;
• an encapsulation block embedding the integrated circuit chip, said encapsulation block extending over the integrated circuit chip and around the integrated circuit chip on said mounting face of the support plate, the encapsulation block having a through hole exposing the electrical contact at the mounting face of the support plate;
• a conductive element made of an electrically conductive material and at least partly carried by said encapsulation block, said conductive element having a main portion extending parallel to said support plate and having a secondary portion extending into said through hole;
• and
• a soldering material interposed between said secondary portion of said conductive element and said electrical contact.

An electronic device, comprising:

• a support plate having a mounting face and including an electrical connection network;
• an integrated circuit chip having a first face mounted on said mounting face of the support plate and linked to said electrical connection network and a second face with an electrical contact;
• an encapsulation block embedding the integrated circuit chip, said encapsulation block extending over the integrated circuit chip and around the integrated circuit chip on said mounting face of the support plate, the encapsulation block having a through hole exposing the electrical contact at the second face of the integrated circuit chip;
• a conductive element made of an electrically conductive material and at least partly carried by said encapsulation block, said conductive element having a main portion extending parallel to said support plate and having a secondary portion extending into said through hole;
• and
• a soldering material interposed between said secondary portion of said conductive element and said electrical contact.

An electronic device, comprising:

• a support plate having a mounting face and including an electrical connection network;
• an integrated circuit chip mounted on said mounting face of the support plate and linked to said electrical connection network;
• an encapsulation block embedding the integrated circuit chip, said encapsulation block extending over the integrated circuit chip and around the integrated circuit chip on said mounting face of the support plate, the encapsulation block having a through hole exposing part of the mounting face of the support plate;
• and
• a conductive element made of an electrically conductive material and at least partly embedded in said encapsulation block, said conductive element having a main portion extending parallel to said support plate and having a secondary portion extending into the through hole of the encapsulation block and linked electrically to said integrated circuit chip.