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US 9,754,849 B2Granted
Organic-inorganic hybrid structure for integrated circuit packages
AssigneeIntel Corporation
InventorsPlory Huang, Henry Su, Chee Key Chung, Ryan Ong, Jones Wang, Daniel Hsieh
Life of this patent
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Abstract
An organic-inorganic hybrid structure is described for integrated circuit packages. In one example, an integrated circuit package includes a ceramic frame having a top side and a bottom side, the top side having a pocket with a bottom floor and a plurality of conductive through holes in the bottom floor, an integrated circuit die attached to the bottom floor over the conductive through holes, and a redistribution layer on the bottom side connected to the conductive through holes.
Claims17
An integrated circuit package comprising:
- a pocketed ceramic frame being a single ceramic slab, the slab comprising a top side and a bottom side, the top side having a pocket formed in the slab, the pocket having a bottom floor, side walls, and a plurality of conductive through holes in the bottom floor extending through the slab;
- an integrated circuit die attached to the bottom floor over the conductive through holes;
- and
- a redistribution layer on the bottom side connected to the conductive through holes.
1 more element
A computing device comprising:
- a system board;
- a communication package connected to the system board;
- and
- an integrated circuit package connected to the system board, the integrated circuit package having a pocketed ceramic frame being a single ceramic slab, the slab comprising a top side and a bottom side, the top side having a pocket formed in the slab, the pocket having a bottom floor, side walls, and a plurality of conductive through holes in the bottom floor extending through the slab, an integrated circuit die attached to the bottom floor over the conductive through holes, and a redistribution layer on the bottom side connected to the conductive through holes.
1 more element
Dependencies are inferred from the claim text.