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US 9,754,845 B2Granted
Systems and methods for chemical mechanical planarization with photo-current detection
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorI-Shuo Liu
Life of this patent
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Abstract
A method includes performing a chemical-mechanical planarization (CMP) on an article, providing a polishing fluid capable of transferring charges to the article, and detecting a current generated in response to the charges transferred to the article. An apparatus that is capable of performing the method and a system that includes the apparatus are also disclosed.
Claims20
A system for performing chemical-mechanical planarization (CMP) on an article using polishing fluid, comprising:
- a polishing fluid in contact with the article, the polishing fluid comprising light absorbing particles;
- and
- a current detector for detecting a current caused by a transfer of charges to the article from the light absorbing particles in the polishing fluid in response to light incident on the polishing fluid.
A system configured to perform a chemical-mechanical planarization (CMP) on an article, comprising:
- a polishing head configured to hold the article;
- a polishing fluid capable of transferring charges to the article in response to light incident on the polishing fluid;
- and
- a current detector configured to detect a current generated in response to the transfer of charges from the polishing fluid to the article.
1 more element
A method comprising:
- performing a chemical-mechanical planarization (CMP) on an article;
- providing a polishing fluid capable of transferring charges to the article in response to light incident upon the polishing fluid;
- and
- detecting a current generated in response to the transfer of charges to the article.
1 more element
Dependencies are inferred from the claim text.