Packaging methods for fabrication of analytical device packages and analytical device packages made thereof

A method for making analytical device packages, comprising:

• (a) providing a sensor wafer that has been treated with selective depositions, wherein the sensor wafer comprises a plurality of sensor chips, and each sensor chip comprises a plurality of electrical contacts and an aperture region with an array of nanometer-scale apertures, wherein treatment with the selective depositions produces different surface characteristics at different portions of the aperture region;
• (b) mounting a plurality of plates on the sensor wafer, wherein each plate is aligned with a corresponding sensor chip such that an opening of the plate is above the aperture region of the corresponding sensor chip, and the opening of the plate is covered by a protective layer to protect the aperture region of the corresponding sensor chip during at least one subsequent process;
• (c) dicing the sensor wafer to obtain a plurality of dies, wherein each die comprises one sensor chip and one plate on top of the one sensor chip;
• (d) providing a plurality of packaging substrates, each comprising a plurality of electrical contacts;
• (e) attaching a die to each of the packaging substrates;
• (f) connecting the electrical contacts of a respective sensor chip with the electrical contacts of a corresponding packaging substrate;
• and
• (g) removing the protective layer from the plate of the die to expose the aperture region.