Wiring substrate, method for manufacturing wiring substrate, electronic device and method for manufacturing electronic device
AssigneeFujitsu Limited
InventorsTaiga Fukumori, Daisuke Mizutani, Mamoru Kurashina
Life of this patent
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Abstract
A wiring substrate includes: a substrate; an insulator formed in the substrate and having a through hole; an electrode formed in the substrate and provided within the through hole; and a conductor bonded to the electrode and provided within the through hole, wherein the through hole has a shape that is widened toward a direction away from the substrate, and the conductor is configured to cover the entire top surface of the electrode and has a shape that is widened toward the direction away from the substrate.
Claims8
A method for manufacturing a wiring substrate comprising:
- arranging an insulator on a substrate so that an electrode of the substrate is accommodated within a through hole of the insulator;
- disposing a first solder ball in a bottom of the through hole;
- disposing a second solder ball, that is greater than the first solder ball, on the first solder ball, a part of the second solder ball sticks out from the through hole;
- and
- forming a conductor in the through hole by melting the first and second solder balls, the conductor and the electrode are bonded to each other,
- wherein the through hole is made to have a shape that is widened toward a direction away from the substrate, and
- the conductor is made to cover the entire top surface of the electrode and has a shape that is widened toward the direction away from the substrate.
A method of manufacturing an electronic device comprising:
- arranging an insulator on a first substrate so that a first electrode of the first substrate is accommodated within a through hole of the insulator;
- disposing a first solder ball in a bottom of the through hole;
- disposing a second solder ball, that is greater than the first solder ball, on the first solder ball, a part of the second solder ball sticks out from the through hole;
- and
- forming a conductor in the through hole by melting the first and second solder balls, the conductor and the electrode are bonded to each other, and
- bonding the conductor to a second electrode of a second substrate,
- wherein the through hole is made to have a shape that is widened toward a direction away from the first substrate, and
- the conductor is made to cover the entire top surface of the first electrode and has a shape that is widened toward the direction away from the first substrate.
Dependencies are inferred from the claim text.