Self-aligned conductive polymer pattern placement error compensation layer
AssigneeGlobalfoundries Inc.
InventorsErik R. Hosler, Deniz E. Civay
Life of this patent
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Abstract
A method includes forming a first conductive feature positioned in a first dielectric layer. A conductive polymer layer is formed above the first dielectric layer and the first conductive feature. The conductive polymer layer has a conductive path length. A second dielectric layer is formed above the first dielectric layer. A first via opening is formed in the second dielectric layer and the conductive polymer layer to expose the first conductive feature. A conductive via is formed in the first via opening. The conductive via contacts the first conductive feature and the conductive polymer layer.
Claims18
A method, comprising:
- forming a first conductive feature positioned in a first dielectric layer;
- forming a self-aligning polymer layer above said first dielectric layer and said first conductive feature;
- forming a second dielectric layer above said first dielectric layer;
- forming a first via opening in said second dielectric layer to expose a portion of said self-aligning polymer layer;
- forming a conductive via in said first via opening, said conductive via contacting said exposed portion of said self-aligning polymer layer;
- and
- applying a current through said conductive via, said self-aligning polymer layer, and said first conductive feature to form a conductive region in said self-aligning polymer layer, wherein, prior to applying said current, said self-aligning polymer layer comprises an insulating material.
A method, comprising:
- forming a first conductive feature positioned in a first dielectric layer;
- forming a self-aligning polymer layer above said first dielectric layer and said first conductive feature;
- forming a second dielectric layer above said first dielectric layer;
- forming a first via opening in said second dielectric layer to expose a portion of said self-aligning polymer layer;
- forming a conductive via in said first via opening, said conductive via contacting said exposed portion of said self-aligning polymer layer;
- annealing said self-aligning polymer layer at a first temperature;
- and
- applying a current through said conductive via, said self-aligning polymer layer, and said first conductive feature to form a conductive region in said self-aligning polymer layer while maintaining said self-aligning polymer layer at a second temperature less than said first temperature.
A device, comprising:
- a conductive feature positioned in a first dielectric layer;
- a polymer layer positioned above said first dielectric layer and said conductive feature, wherein said polymer layer comprises a first insulating portion and a second conductive portion, wherein said second conductive portion contacts at least a first portion of said conductive feature, and said second conductive portion is positioned in a region where said via overlaps said conductive feature;
- and
- a via positioned in a second dielectric layer and contacting at least a portion of said second conductive portion.
Dependencies are inferred from the claim text.