Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods
AssigneeMicron Technology, Inc.
InventorsHongqi Li, Anurag Jindal, Jin Lu, Shyam Ramalingam
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Abstract
Semiconductor devices having interconnects incorporating negative expansion (NTE) materials are disclosed herein. In one embodiment a semiconductor device includes a substrate having an opening that extends at least partially through the substrate. A conductive material having a positive coefficient of thermal expansion (CTE) partially fills the opening. A negative thermal expansion (NTE) having a negative CTE also partially fills the opening. In one embodiment, the conductive material includes copper and the NTE material includes zirconium tungstate.
Claims19
A method of manufacturing a semiconductor device, comprising:
- partially filling an opening in a substrate with a first material, wherein the first material has a positive coefficient of thermal expansion (CTE);
- and
- further filling the opening with a second material, wherein the second material has a negative CTE,
- wherein the first material is between the substrate and the second material.
A method of manufacture, comprising forming an interconnect structure, wherein:
- the interconnect structure includes a conductive material and a negative thermal expansion (NTE) material within at least a portion of the conductive material;
- and
- the interconnect structure has a composite coefficient of thermal expansion (CTE) based, at least in part, on a volume of the NTE material within the conductive material.
A method of manufacture, comprising forming an interconnect structure:
- disposing a first material in an opening in a substrate,
- wherein the first material has a positive coefficient of thermal expansion (CTE);
- and
- disposing a second material in the opening in the substrate,
- wherein the second material has a negative CTE, and
- wherein the first material is between the substrate and the second material.
Dependencies are inferred from the claim text.