Substrate including selectively formed barrier layer

A method of selectively locating a barrier layer on a substrate, the method comprising:

• forming a barrier layer on a surface of the substrate, the barrier layer comprising a metal element and a non-metal element;
• forming an electrically conductive film layer on the barrier layer;
• forming a metallic portion in the electrically conductive film layer;
• selectively ablating portions of the barrier layer from a dielectric layer after forming the metallic portion so as to form trenches that expose portions of the dielectric layer having a first height that is less than a second height of the metallic portion;
• forming an encapsulation layer in the exposed portions of the dielectric layer and selectively radiating the encapsulation layer based on a first thickness of the metallic portion and a second thickness of the barrier layer.