Dicing sheet with protective film forming layer and method for producing chip
AssigneeLintec Corporation
InventorsNaoya Saeki, Tomonori Shinoda, Ken Takano
Life of this patent
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Abstract
[Problem] To provide a dicing sheet that is with a protective film formation layer, can easily produce a semiconductor chip having a protective film having high uniformity and superior printing precision, is such that the peeling of the protective film and the dicing sheet can be easily performed, and has superior affixing ability of chips during dicing. [Solution] The dicing sheet with a protective film formation layer is characterized by a protective film formation layer being peelably provided on the adhesive layer of an adhesive sheet resulting from the adhesive layer, which contains an adhesive component and a free epoxy group-containing compound, being laminated onto a substrate film.
Claims18
A dicing sheet with a protective film forming layer, comprising:
- an adhesive sheet, the adhesive sheet comprising an adhesive layer and a base film;
- and
- a protective film forming layer, wherein
- the protective film forming layer is provided on the adhesive layer of the adhesive sheet in which and the adhesive layer is laminated on the base film,
- the adhesive layer comprises an adhesive component and free epoxy group containing compound,
- the adhesive component comprises an energy ray crosslinkable polymer in which methacryloyloxyethyl isocyanate is reacted to (meth)acrylic acid ester polymer made from 2-ethylhexylacrylate, vinyl acetate and hydroxyl ethyl acrylate, and
- the dicing sheet with the protective film forming layer has a property that when the dicing sheet with the protective film forming layer is cut to make a sample with a width of 25 mm and then the sample is adhered to the silicon wafer while heating at 70° C., an adhesive force between the adhesive sheet and the protective film forming layer is from 0.10 to 0.43 N/25 mm.
A dicing sheet with a protective film forming layer, comprising:
- an adhesive sheet, the adhesive sheet comprising an adhesive layer and a base film;
- and
- a protective film forming layer, wherein
- the protective film forming layer is provided on the adhesive layer of the adhesive sheet and the adhesive layer is laminated on the base film,
- the adhesive layer comprises an adhesive component and free epoxy group containing compound,
- the adhesive component comprises an energy ray crosslinkable polymer in which methacryloyloxyethyl isocyanate is reacted to (meth)acrylic acid ester polymer made from butylacrylate, methyl acrylate and hydroxyl ethtyl acrylate, and
- the dicing sheet with the protective film forming layer has a property that when the dicing sheet with the protective film forming layer is cut to make a sample with a width of 25 mm and then the sample is adhered to the silicon wafer while heating at 70° C., an adhesive force between the adhesive sheet and the protective film forming layer is from 0.10 to 0.43 N/25 mm.
A dicing sheet with a protective film forming layer, comprising:
- an adhesive sheet, the adhesive sheet comprising an adhesive layer and a base film;
- and
- a protective film forming layer, wherein
- the protective film forming layer is provided on the adhesive layer of the adhesive sheet and the adhesive layer is laminated on the base film,
- the adhesive layer comprises an adhesive component and free epoxy group containing compound,
- the protective film forming layer comprises a binder polymer component and a curable component,
- the curable component is an epoxy based heat curable component,
- the epoxy based heat curable component is an epoxy based compound combining bisphenol A type epoxy resin and dicyclopentadiene type epoxy resin, and
- the dicing sheet with the protective film forming layer has a property that when the dicing sheet with the protective film forming layer is cut to make a sample with a width of 25 mm and then the sample is adhered to the silicon wafer while heating at 70° C., an adhesive force between the adhesive sheet and the protective film forming layer is from 0.10 to 0.43 N/25 mm.
Dependencies are inferred from the claim text.