Method for the production of a wafer with a carrier unit

A system for producing layers of solid material as wafers, the system being operable for:

• separating one or more layers of solid material for a workpiece having at least one exposed surface;
• producing and/or providing a carrier unit for receiving at least one layer of the solid material, the carrier unit being made in a number of layers and having a stabilisation layer being overlapped at least partially by a receiving layer, the receiving layer being made to hold the layers of solid material, the stabilisation layer being formed, at least partially, to have an E modulus greater than an E modulus of the receiving layer;
• connecting the receiving layer to the exposed surface of the workpiece to form a composite structure;
• exposing the composite structure to an inner and/or outer stress field such that the layers of solid material is separated along a plane of the workpiece extending within the workpiece;
• and
• producing and/or providing the receiving layer to include a polymer, exposing the composite structure, consisting of the receiving layer and the workpiece, to an inner and/or outer stress field with at least one part of the polymer undergoing at least one glass transition.

A wafer produced by the process of:

• separating one or more layers of solid material for a workpiece having at least one exposed surface;
• producing and/or providing a carrier unit for receiving at least one layer of the solid material, the carrier unit being made in a number of layers and having a stabilisation layer being overlapped at least partially by a receiving layer, the receiving layer being made to hold the layers of solid material, the stabilisation layer being formed, at least partially, to have an E modulus greater than an E modulus of the receiving layer;
• connecting the receiving layer to the exposed surface of the workpiece to form a composite structure;
• exposing the composite structure to an inner and/or outer stress field such that the layers of solid material is separated along a plane of the workpiece extending within the workpiece;
• and
• producing and/or providing the receiving layer to include a polymer, exposing the composite structure, consisting of the receiving layer and the workpiece, to an inner and/or outer stress field with at least one part of the polymer undergoing at least one glass transition.