Electronic device, electronic apparatus, moving object, and method for manufacturing electronic device
AssigneeSeiko Epson Corporation
InventorManabu Kondo
Life of this patent
Estimating the term…
Abstract
An electronic device includes: an electronic component including an external connection terminal; and a lead frame (metal member) connected to the external connection terminal. The lead frame is disposed with a pad. The pad overlaps the external connection terminal in plan view, and at least a portion of the pad is located outside the external shape of the electronic component in plan view. The pad and the external connection terminal are connected by means of a conductive bonding member. The pad and the electronic component are bonded together with a resin. The resin extends to a region of the pad located outside the external shape of the electronic component in plan view.
Claims10
An electronic device comprising:
- an electronic component including an external connection terminal;
- and a metal member connected to the external connection terminal, wherein the metal member has an elongated lead portion having a connecting portion, and a pad, the connecting portion connecting the elongated lead portion to the pad and being bent, the pad having a longer width than the elongated lead portion in a direction perpendicular to an elongated direction, the pad overlapping the external connection terminal in plan view, at least a portion of the pad being located outside an external shape of the electronic component in plan view, the pad and the external connection terminal are connected by means of a conductive bonding member, the pad and the electronic component are bonded together with a resin, the resin extends only i) to a region of the pad located outside the external shape of the electronic component in plan view, ii) to a region between a bottom surface of the pad and a top surface of the electronic component or between a top surface of the pad and a bottom surface of the electronic component, iii) to the sides of the electronic component extending from an edge of the top or bottom surface thereof, and iv) along an external shape of the pad that overlaps the electronic component in plan view, and the pad covers an entirety of the external connection terminal in plan view.
Dependencies are inferred from the claim text.