Making thin-film multi-layer micro-wire structure

A method of making a thin-film multi-layer micro-wire structure, comprising:

• providing a substrate having a substrate surface;
• providing a layer on the substrate surface or as part of the substrate, the layer having a layer surface and one or more micro-channels formed in the layer, each micro-channel having a width less than or equal to 20 microns;
• coating a first conductive material over the layer surface and in the one or more micro-channels, the first conductive material including silver nano-particles;
• removing the coated first conductive material from the layer surface but not the one or more micro-channels;
• curing the first conductive material in the one or more micro-channels to form an electrically conductive first micro-wire located only within each micro-channel, the first micro-wire having a width less than or equal to 20 microns and a depth less than or equal to 20 microns, wherein the first micro-wire has a percent ratio of silver that is greater than or equal to 40% by weight;
• and
• electrolessly plating each first micro-wire to form a plated layer located only within each micro-channel, the plated layer being in electrical contact with the first micro-wire and having a thickness less than a thickness of the first micro-wire;
• locating a second conductive material over the layer surface and over the plated layer in each micro-channel after each first micro-wire is electrolessly plated, the second conductive material including silver nano-particles;
• removing the second conductive material from the layer surface but not the one or more micro-channels;
• curing the second conductive material in the one or more micro-channels to form a cured second material, wherein the cured second material has a percent ratio of silver that is greater than or equal to 40% by weight.

A method of making a thin-film multi-layer micro-wire structure, comprising

• providing a substrate having a substrate surface;
• locating a curable layer on the substrate surface, imprinting one or more micro-channels in the curable layer, and curing the curable layer to form a cured layer having one or more imprinted micro-channels, each micro-channel having a width less than or equal to 20 microns, the cured layer having a layer surface;
• coating a conductive material over the layer surface and in the one or more micro-channels, the conductive material including silver nano-particles;
• removing the coated conductive material from the layer surface but not the one or more micro-channels;
• curing the conductive material in the one or more micro-channels to form an electrically conductive first micro-wire located only within each micro-channel, the first micro-wire having a width less than or equal to 20 microns and a depth less than or equal to 20 microns, wherein the first micro-wire has a percent ratio of silver that is greater than or equal to 40% by weight;
• electrolessly plating each first micro-wire to form a plated layer located at least partially within each micro-channel between the first micro-wire and the layer surface, the plated layer being in contact with the first micro-wire and having a thickness less than a thickness of the first micro-wire;
• and
• locating a curable material in the one or more micro-channels and curing the curable material to form a cured material in each micro-channel, the cured material being in contact with the plated layer on a side of the plated layer opposite the first micro-wire.