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US 9,754,676 B2Granted
Semiconductor device
AssigneeToshiba Memory Corporation
InventorsShinya Okuno, Shigeki Nagasaka, Toshiyuki Kouchi
Life of this patent
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Abstract
A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.
Claims9
A semiconductor device comprising:
- a first semiconductor chip which outputs data, the first semiconductor chip including a first via which conducts from the upper surface to the lower surface thereof;
- a second semiconductor chip which is connected to the first via by a first bump;
- a first FIFO which is formed on the second semiconductor chip and receives the data outputted from the first semiconductor chip through the first via and the first bump;
- and
- an input/output circuit which outputs the data from the first FIFO and is formed on the second semiconductor chip,
- wherein the first FIFO is located closer to the input/output circuit than a middle point of an interconnect line connected between the first bump and the input/output circuit.
3 more elements
Dependencies are inferred from the claim text.