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US 9,754,365 B2Granted
Wafer inspection method and software
AssigneeApplied Materials, Inc.
InventorsAsaf Schlezinger, Markus J. Stopper
Life of this patent
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Abstract
Embodiments of the present invention generally relate to methods for inspecting wafers. After a brick is sliced into a plurality of bare wafers, a two-dimensional (2D) photoluminescence (PL) image of each wafer is taken, the PL images of the wafers in sequential order (i.e., the sequence of the wafers as they are sliced from the brick) are then combined to construct a three-dimensional (3D) model of the brick that highlights similar regions in the brick.
Claims20
A method for inspecting wafers, comprising:
- combining two-dimensional photoluminescence images of each wafer of a plurality of wafers, wherein the images of the plurality of wafers are combined in sequential order corresponding to a position of each wafer in a brick prior to slicing of the brick;
- and
- constructing a three-dimensional photoluminescence model of the brick highlighting similar regions within the brick, wherein the three-dimensional photoluminescence model is constructed from combining the two-dimensional photoluminescence images in sequential order.
A method, comprising:
- slicing a brick to form a plurality of wafers;
- taking a two-dimensional photoluminescence image of each wafer of the plurality of wafers;
- sorting the two-dimensional photoluminescence images of the wafers in sequential order to produce sequential two-dimensional photoluminescence images;
- combining the sequential two-dimensional photoluminescence images;
- and
- constructing a three-dimensional photoluminescence model of the brick, wherein the three-dimensional photoluminescence model is constructed from combining the sequential two-dimensional photoluminescence images.
3 more elements
Dependencies are inferred from the claim text.