Back to results
US 9,754,150 B2Granted
Fingerprint identification module
AssigneeGingy Technology Inc.
InventorJen-Chieh Wu
Life of this patent
Estimating the term…
Abstract
A fingerprint identification module including a cover plate, a fingerprint identification sensor, a first adhesive layer, and at least one light source is provided. The cover plate has an inner surface, an outer surface opposite to the inner surface, and a plurality of microstructures located at the inner surface. The fingerprint identification sensor is located under the microstructures and attached to the microstructures through the first adhesive layer. The at least one light source is located under the inner surface and adjacent to the fingerprint identification sensor.
Claims10
A fingerprint identification module, comprising:
- a cover plate, having an inner surface, an outer surface opposite to the inner surface, and a plurality of microstructures located at the inner surface;
- a fingerprint identification sensor, located under the microstructures;
- a first adhesive layer, wherein the fingerprint identification sensor is attached to the microstructures through the first adhesive layer;
- and
- at least one light source, located under the inner surface and adjacent to the fingerprint identification sensor.
2 more elements
Dependencies are inferred from the claim text.