Electronic devices with multi-layer heat reduction components

A system for powering an electronic device having a multi-layer heat reduction component, the system comprising:

• an electronic device to, when in both a mobile mode and a docked mode, provide supplemental processing power to a mobile device, the electronic device comprising:
• a number of integrated circuits coupled to a printed circuit board (PCB);
• a multi-layer heat reduction component comprising a retractable outer layer, an air gap that is at least 2 millimeters (mm) thick, and an inner layer coupled to at least one of the number of integrated circuits, wherein the retractable outer layer, the inner layer, and the air gap are arranged such that the air gap separates the retractable outer layer and the inner layer,
• the multi-layer heat reduction component further comprising a retraction feature to receive a trigger of a docking station, and responsive to an interaction between the trigger and the retraction feature the retractable outer layer is to expose the inner layer to a cooling system of the docking station;
• and
• the docking station to comprise a cooling system comprising a liquid cooling coil and a fan and responsive to coupling with the electronic device, the docking station is to:
• allow the electronic device to operate in a high power mode;
• and
• cool the electronic device via the cooling system of the docking station, the cooling system arranged such that the liquid cooling coil is within the air gap and adjacent to the inner layer of the electronic device;
• in which the electronic device is to operate in a low power mode when not docked.

An electronic device comprising:

• a number of integrated circuits coupled to a printed circuit board (PCB);
• a multi-layer heat reduction component comprising:
• a first layer coupled to at least one of the number of integrated circuits to remove heat from the at least one integrated circuit;
• and
• a second layer separated from the first layer by an air gap that is at least 2 millimeters (mm) thick to act as an insulation layer in a lower power mobile mode to reduce a thermal output of the electronic device;
• a retraction feature to receive a trigger of a docking station, and
• wherein the first layer, the second layer, and the retraction feature are arranged such that, responsive to an interaction between the trigger of the docking station and the retraction feature of the multi-layer heat reduction component, the second layer retracts and receives a liquid cooling coil of a cooling system of the docking station within the air gap adjacent to the exposed first layer to actively cool the electronic device through the air gap and the electronic device operates in a higher power docked mode;
• and
• a sensor system to:
• indicate when the electronic device is in an enclosed environment;
• and
• responsive to an indication of an enclosed environment, place the electronic device in a standby mode until an output of the sensor system is de-asserted.