# US 9,753,382 B2 · Sensor, lithographic apparatus and device manufacturing method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,753,382 B2 - Document ID: US9753382B2 - Status: Granted - Kind: B2 - Application number: 14/397,126 - Filed: 2013-03-19 - Published: 2015-03-19 - Granted: 2017-09-05 - Earliest claimed: 2012-05-22 - Assignees: ASML Netherlands B.V. - Applicants: ASML Netherlands B.V. - Inventors: Thibault Simon Mathieu Laurent; Johannes Henricus Wilhelmus Jacobs; Haico Victor Kok; Yuri Johannes Gabriël Van De Vijver; Johannes Antonius Maria Van De Wal; Bastiaan Andreas Wilhelmus Hubertus Knarren; Robbert Jan Voogd; Jan Steven Christiaan Westerlaken; Johannes Hubertus Antonius Van De Rijdt; Allard Eelco Kooiker; Wilhelmina Margareta Jozef Hurkens-Mertens; Yohann Bruno Yvon Teillet - Web page: https://patentgrep.com/patent/US9753382B2 ## CPC - G03F 7/7085: {Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load} - G03F 7/70341: {Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply (chemical composition of immersion liquids G03F7/2041)} - G03F 7/70666: {Aerial image, i.e. measuring the image of the patterned exposure light at the image plane of the projection system} - G03F 7/70858: {Environment aspects, e.g. pressure of beam-path gas, temperature (pollution aspects G03F7/70916)} - G03F 7/70891: {Temperature} - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) ## Abstract A sensor for use in lithographic apparatus of an immersion type and which, in use, comes into contact with the immersion liquid is arranged so that the thermal resistance of a first heat path from a transducer of the sensor to a temperature conditioning device is less than the thermal resistance of a second heat flow path from the transducer to the immersion liquid. Thus, heat flow is preferentially towards the temperature conditioning device and not the immersion liquid so that temperature-induced disturbance in the immersion liquid is reduced or minimized. ## Claims ### Claim 1 A sensor for use in a lithographic apparatus of an immersion type, the sensor comprising: a member that, in use of the sensor, contacts an immersion liquid supplied to a space adjacent an element of a projection system; a transducer configured to convert a stimulus to an electric signal; and a temperature conditioning device, wherein a first heat flow path between the transducer and the temperature conditioning device has a lower thermal resistance than a second heat flow path between the transducer and the immersion liquid, and wherein a gap is provided between the temperature conditioning device and the transducer. ### Claim 2 (depends on 1) The sensor according to claim 1, wherein the transducer is mounted on a support member, the support member providing a thermal path between the transducer and the temperature conditioning device. ### Claim 3 (depends on 2) The sensor according to claim 2, wherein the transducer is mounted on a face of the support member that faces towards the immersion liquid. ### Claim 4 (depends on 2) The sensor according to claim 2, further comprising an electric circuit configured to receive the electric signal generated by the transducer. ### Claim 5 (depends on 4) The sensor according to claim 4, wherein the electric circuit is mounted on a surface of the support member that faces away from the immersion liquid, wherein the first heat flow path also conducts heat generated by the electric circuit to the temperature conditioning device. ### Claim 6 (depends on 1) The sensor according to claim 1, wherein the transducer is at least one selected from the group consisting of a photodiode, a charge coupled device, a camera and a CMOS camera. ### Claim 7 (depends on 1) The sensor according to claim 1, wherein the member includes a window that is transparent. ### Claim 8 (depends on 7) The sensor according to claim 7, wherein an opaque pattern is provided in or on the transparent window. ### Claim 9 (depends on 1) The sensor according to claim 1, wherein a gap and/or a thermally insulating layer is present between the transducer and the member. ### Claim 10 (depends on 1) The sensor according to claim 1, wherein the temperature conditioning device comprises a body having defined therein a conduit to circulate a heat transfer medium. ### Claim 11 (depends on 1) The sensor according to claim 1, wherein the temperature conditioning device and the transducer are contactlessly thermally coupled. ### Claim 12 A sensor for use in an immersion lithographic apparatus, the sensor comprising: a surface of a member that, in use of the sensor, contacts an immersion liquid supplied to a space adjacent an element of a projection system; a transducer configured to convert a stimulus to an electric signal; and a temperature conditioning device, wherein the transducer has greater thermal coupling to the temperature conditioning device than the transducer to the surface of the member, and wherein a gap is provided between the temperature conditioning device and the transducer. ### Claim 13 (depends on 1) The sensor according to claim 1, further comprising a control system configured to control the temperature of the member. ### Claim 14 (depends on 1) A lithographic apparatus, comprising: a projection system configured to project a beam patterned by a patterning device onto a substrate; a substrate table configured to support the substrate; a liquid supply system configured to provide a liquid to a space between the projection system and the substrate table; and a sensor according to claim 1. ### Claim 15 A device manufacturing method using a lithographic apparatus, the method comprising: projecting a beam patterned by a patterning device onto a substrate using a projection system while providing a liquid to a space between the projection system and the substrate; and sensing a parameter of the lithographic apparatus or of the projecting using a sensor comprising: a member that contacts the liquid supplied to the space; a transducer configured to convert a stimulus to an electric signal, and a temperature conditioning device, wherein a first heat flow path between the transducer and the temperature conditioning device has a lower thermal resistance than a second heat flow path between the transducer and the liquid, and wherein a gap is provided between the temperature conditioning device and the transducer. ### Claim 16 (depends on 2) The sensor according to claim 2, wherein the support member is separable from the temperature conditioning device. ### Claim 17 (depends on 2) The sensor according to claim 2, wherein a small gap is formed between opposing surfaces of the temperature conditioning device and the support member and the opposing surfaces are non-flat. ### Claim 18 (depends on 12) The sensor according to claim 12, wherein the temperature conditioning device and the transducer are contactlessly thermally coupled. ### Claim 19 (depends on 12) The sensor according to claim 12, wherein the transducer is mounted on a support member, the support member providing a thermal path between the transducer and the temperature conditioning device. ### Claim 20 (depends on 19) The sensor according to claim 19, wherein the support member is separable from the temperature conditioning device.