# US 9,753,340 B2 · Display device

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- Number: US 9,753,340 B2
- Document ID: US9753340B2
- Status: Granted
- Kind: B2
- Application number: 14/508,331
- Filed: 2014-10-07
- Published: 2015-04-09
- Granted: 2017-09-05
- Earliest claimed: 2013-10-08
- Assignees: Japan Display Inc.
- Applicants: Japan Display Inc.
- Inventors: Tomokazu Saitou
- Web page: https://patentgrep.com/patent/US9753340B2

## CPC

- G02F 1/13458: {Terminal pads}
- G02F 1/13452: {Conductors connecting driver circuitry and terminals of panels}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

In a display device that a terminal of a display panel is connected to bumps of the driver IC via an ACF, the driver IC includes input-side and output-side bump arrays arranged along mutually facing long sides. In configurations of the driver IC, a width A of a short side thereof ≧1.45 mm, a thickness thereof B ≦0.20 mm, a dimension C between input-side and output-side bumps ≧1.10 mm, a length D of each bump ≧98 μm, a minimum dimension F between the bumps ≦15 μm, a number of arrays G of the output-side bump ≧2 (two arrays) and a particle size E of a conductive particle contained in the anisotropic conductive film ≦3.5 μm, not more than six configurations are included.

## Claims

### Claim 1

A display device, comprising:
a display panel; and
a rectangular driver IC connected to the display panel via an anisotropic conductive film,
wherein the driver IC has an input-side bump array and an output-side bump array along mutually facing long sides, and
in configurations listed as follows as seven items of
(1) a width A of a short side of the driver IC ≧1.45 mm,
(2) a thickness B of the driver IC ≦0.20 mm,
(3) a dimension C between input-side and output-side bumps of the driver IC ≧1.10 mm,
(4) a length D of each bump of the driver IC ≧98 μm,
(5) a particle size E of a conductive particle contained in the anisotropic conductive film ≦3.5 μm,
(6) a minimum dimension F between the bumps of the driver IC ≦15 μm and
(7) a number of arrays G of the output-side bumps of the driver IC ≧2 (two arrays), six configurations are included and more than six configurations are not included.

### Claim 2 (depends on 1)

The display device according to claim 1,
wherein the six configurations include the configuration (2).

### Claim 3 (depends on 2)

The display device according to claim 2,
wherein the six configurations include the configuration (5).

### Claim 4 (depends on 3)

The display device according to claim 3,
wherein the six configurations include the configuration (7).

### Claim 5 (depends on 1)

The display device according to claim 1,
wherein the drive IC is of the type to be connected to the display panel in an unpackaged state.