# US 9,753,214 B2 · Light source unit, method of fabricating the light source unit and backlight assembly including the light source unit > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,753,214 B2 - Document ID: US9753214B2 - Status: Granted - Kind: B2 - Application number: 14/320,989 - Filed: 2014-07-01 - Published: 2015-10-08 - Granted: 2017-09-05 - Earliest claimed: 2014-04-02 - Assignees: Samsung Display Co., Ltd. - Applicants: Samsung Display Co., Ltd. - Inventors: Myeong Ju Shin; Seung Hwan Baek; Yeong Bae Lee - Web page: https://patentgrep.com/patent/US9753214B2 ## CPC - G02B 6/0073: {Light emitting diode [LED]} - G02B 6/0026: {Wavelength selective element, sheet or layer, e.g. filter or grating} - G02B 6/009: {of the light source in the package (G02B6/0021 takes precedence)} - B82Y 20/00: Nanooptics, e.g. quantum optics or photonic crystals - Y10S 977/774: Exhibiting three-dimensional carrier confinement, e.g. quantum dots - Y10T 29/49018: with other electrical component - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - B82Y: SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES - Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A light source unit, a method of fabricating the light source unit and a backlight assembly including the light source unit are provided. According to an exemplary embodiment of the inventive concept, there is provided a light source unit, comprising a circuit board, a light-emitting diode (“LED”) package configured to be disposed on the circuit board and including an LED chip emitting light, a wavelength conversion member configured to be disposed on the LED package and convert the wavelength of light emitted from the LED chip, and a mold member configured to be interposed between the LED package and the wavelength conversion member and support the wavelength conversion member. ## Claims ### Claim 1 A light source unit, comprising: a circuit board; a light-emitting diode (“LED”) package configured to be disposed on the circuit board and including an LED chip emitting light, the LED package including a package mold disposed on the circuit board and having a receiving groove receiving the LED chip; a wavelength conversion member configured to be disposed on the LED package and convert the wavelength of light emitted from the LED chip; and a mold member configured to be interposed between the LED package and the wavelength conversion member and support the wavelength conversion member, wherein the mold member directly contacts a top surface of the LED package, wherein the mold member includes a first opening disposed between the circuit board and the wavelength conversion member, the first opening accommodating the LED package therein, and a second opening disposed between the first opening and the wavelength conversion member and extended from the first opening, and wherein a side surface of the second opening and a side surface of the receiving groove are disposed on a same plane. ### Claim 2 (depends on 1) The light source unit of claim 1, wherein the mold member further includes a third opening disposed above the second opening and extended from the second opening and the third opening accommodates the wavelength conversion member therein. ### Claim 3 (depends on 1) The light source unit of claim 1, wherein the LED chip emits blue light. ### Claim 4 (depends on 1) The light source unit of claim 1, wherein the wavelength conversion member includes quantum dots. ### Claim 5 (depends on 1) The light source unit of claim 1, wherein the wavelength conversion member converts light emitted from the LED chip into white light. ### Claim 6 (depends on 1) The light source unit of claim 1, wherein the wavelength conversion member includes: a first substrate disposed on the mold member; a second substrate disposed on the first substrate; and a wavelength conversion layer disposed between the first substrate and the second substrate. ### Claim 7 (depends on 6) The light source unit of claim 6, wherein at least one of the first substrate and the second substrate includes a recess pattern disposed above the LED chip and the wavelength conversion layer is located in the recess pattern. ### Claim 8 (depends on 6) The light source unit of claim 6, wherein the wavelength conversion member further includes a sealant disposed between the first substrate and the second substrate and surrounding the wavelength conversion layer. ### Claim 9 (depends on 1) The light source unit of claim 1, further comprising: a fixing member configured to be disposed along edges of the mold member and the wavelength conversion member and fix the wavelength conversion member. ### Claim 10 A method of fabricating a light source unit, comprising: placing an LED package, which includes an LED chip emitting light and a package mold having a receiving groove which receives the LED chip, on a circuit board; inserting a mold member onto the LED package to directly contact a top surface of the LED package; and inserting a wavelength conversion member, which converts the wavelength of light emitted from the LED chip, into the mold member, wherein the mold member includes a first opening disposed between the circuit board and the wavelength conversion member, the first opening accommodating the LED package therein, and a second opening disposed between the first opening and the wavelength conversion member and extended from the first opening, and wherein a side surface of the second opening and a side surface of the receiving groove are disposed on a same plane. ### Claim 11 (depends on 10) The method of claim 10, further comprising, after the placing the LED package: mounting the LED package on the circuit board. ### Claim 12 (depends on 10) The method of claim 10, further comprising, after the inserting the mold member: mounting the LED package and the mold member at the same time on the circuit board. ### Claim 13 (depends on 10) The method of claim 10, further comprising, before the inserting the wavelength conversion member: preparing the wavelength conversion member, wherein the preparing the wavelength conversion member, comprises: forming a plurality of recess patterns on a first mother substrate, the recess patterns being arranged in a matrix; filling the recess patterns with a wavelength conversion material including quantum dots. ### Claim 14 (depends on 13) The method of claim 13, wherein the preparing the wavelength conversion member, further comprises: forming a sealing member in a lattice pattern on a second mother substrate; and combining the first mother substrate and the second mother substrate by interposing the sealing member therebetween, and each of the recess patterns is surrounded by the sealing member. ### Claim 15 (depends on 14) The method of claim 14, wherein the preparing the wavelength conversion member, further comprises: applying laser beams to the sealing member; and cutting the first mother substrate and the second mother substrate along the middle of each part of the sealing member. ### Claim 16 A backlight assembly, comprising: a light source unit configured to emit light; and a container configured to accommodate the light source unit therein, wherein the light source unit comprises: a circuit board configured to be disposed on the container; an LED package configured to be disposed on the circuit board and including an LED chip emitting light and a package mold having a receiving groove which receives the LED chip; a wavelength conversion member configured to be disposed on the LED package and convert the wavelength of light emitted from the LED chip; and a mold member configured to be interposed between the LED package and the wavelength conversion member and support the wavelength conversion member, wherein the mold member directly contacts a top surface of the LED package, wherein the mold member includes a first opening disposed between the circuit board and the wavelength conversion member, the first opening accommodating the LED package therein, and a second opening disposed between the first opening and the wavelength conversion member and extended from the first opening, and wherein a side surface of the second opening and a side surface of the receiving groove are disposed on a same plane. ### Claim 17 (depends on 16) The backlight assembly of claim 16, further comprising: a light guide panel or a diffusion plate configured to be disposed above the light source unit.