# US 9,753,058 B2 · Wiring board for testing loaded printed circuit board

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- Number: US 9,753,058 B2
- Document ID: US9753058B2
- Status: Granted
- Kind: B2
- Application number: 14/529,033
- Filed: 2014-10-30
- Published: 2015-02-26
- Granted: 2017-09-05
- Earliest claimed: 2009-12-17
- Assignees: Xcerra Corporation
- Applicants: Xcerra Corporation
- Inventors: Mark A. Swart; Kenneth R. Snyder; Stephen J. Koolis; Douglas W. Tackett
- Web page: https://patentgrep.com/patent/US9753058B2

## CPC

- G01R 1/07378: {using an intermediate adapter, e.g. space transformers (G01R1/07371 takes precedence)}
- G01R 31/2801: {Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] (G01R31/318508 takes precedence; contactless testing G01R31/302; testing contacts or connections G01R31/66)}
- G01R 31/2844: {using test interfaces, e.g. adapters, test boxes, switches, PIN drivers (G01R31/2889 takes precedence)}
- G01R 31/31905: {Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture}
- Y10T 29/49126: Assembling bases
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A wiring board for transmission of test signals between test point locations on a circuit board under test and an external analyzer having compliant contacts making electrical contact with a pad positioned on a conductive surface circuit layer having a trace extending to a second pad having a hole for receipt of an interface pin having a swaged head electrically connected to the external analyzer.

## Claims

### Claim 1

A wiring board for transmission of test signals between test point locations on a circuit board under test and an external test analyzer comprising:
a single non-conductive board having a conductive circuit layer positioned on a top surface, the conductive circuit layer having a conductive first pad without a hole in the single non-conductive board and a conductive trace extending to a conductive second pad positioned around a hole extending through the single non-conductive board for receipt of an interface pin extending through the single non-conductive board; and
a compliant contact making electrical contact with the test point locations and the conductive first pad of the circuit layer.

### Claim 2 (depends on 1)

The wiring board of claim 1, wherein there are multiple conductive circuits layered on top of one another on the single non-conductive board.

### Claim 3 (depends on 2)

The wiring board of claim 2, wherein there is a compliant contact and an interface pin for each conductive circuit.

### Claim 4 (depends on 1)

The wiring board of claim 1, wherein the conductive second pad is a via.

### Claim 5 (depends on 4)

The wiring board of claim 4, wherein the interface pin extends through the via.

### Claim 6 (depends on 4)

The wiring board of claim 4, wherein a short headless pin extends through the via for the sole purpose of connecting the conductive second pad on one layer to another layer.

### Claim 7 (depends on 4)

The wiring board of claim 4, wherein the via has at least one flap around an opening which engages the interface pin.

### Claim 8 (depends on 6)

The wiring board of claim 6, wherein vias on successive layers have at least one flap rotated with respect to adjacent layers.

### Claim 9 (depends on 1)

The wiring board of claim 1, wherein the interface pin has a smooth round portion for contacting the conductive second pad at the middle or end of a trace.

### Claim 10 (depends on 1)

The wiring board of claim 1, wherein the conductive second pad is a via.

### Claim 11 (depends on 1)

The wiring board of claim 1, wherein the interface pin has a swaged or crimped feature for mechanical retention.

### Claim 12 (depends on 1)

The wiring board of claim 1, wherein the interface pin is piano or music wire.

### Claim 13 (depends on 1)

The wiring board of claim 1, further having a spare interface pin extending from a bottom of the wiring board which is wired to a rework receptacle.

### Claim 14 (depends on 1)

The wiring board of claim 1, further having a replacement interface pin extending from a bottom of the wiring board which is wired to a short pin when an offset of the interface pin is too large to tilt or bend into a normal position.

### Claim 15 (depends on 1)

The wiring board of claim 1, further comprising a probe socket extending through the non-conductive board for repair purposes or for the support of special purpose test probes.

### Claim 16 (depends on 1)

The wiring board of claim 1, wherein height of the test probes are controlled by a depth of a counter bore in a top plate so that the height is set for optimal compression when testing solder mask defined (SMD) lands or component leads of varying heights.