# US 9,752,943 B2 · Sensor structures, systems and methods with improved integration and optimized footprint > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,752,943 B2 - Document ID: US9752943B2 - Status: Granted - Kind: B2 - Application number: 14/498,584 - Filed: 2014-09-26 - Published: 2015-07-30 - Granted: 2017-09-05 - Earliest claimed: 2014-01-24 - Assignees: Infineon Technologies Dresden GmbH - Applicants: Infineon Technologies Dresden GmbH - Inventors: Thoralf Kautzsch; Heiko Froehlich; Mirko Vogt; Maik Stegemann; Andre Röth; Bernhard Winkler; Boris Binder - Web page: https://patentgrep.com/patent/US9752943B2 ## CPC - G01L 9/00: Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements {(G01L11/004 takes precedence)}; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means (measuring differences of two or more pressure values G01L13/00; measuring two or more pressure values simultaneously G01L15/00) - B81B 3/0072: {For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers} - G01L 9/0044: {Constructional details of non-semiconductive diaphragms} - G01L 9/0072: {using variations in capacitance} - B81B 2201/0264: Pressure sensors - B81B 2203/0127: Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function - G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G) - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) ## Abstract Embodiments relate to sensors and more particularly to structures for and methods of forming sensors that are easier to manufacture as integrated components and provide improved deflection of a sensor membrane, lamella or other movable element. In embodiments, a sensor comprises a support structure for a lamella, membrane or other movable element. The support structure comprises a plurality of support elements that hold or carry the movable element. The support elements can comprise individual cylindrical points or feet-like elements with straight or concave sidewalls, rather than a conventional interconnected frame, that enable improved motion of the movable element, easier removal of a sacrificial layer between the movable element and substrate during manufacture and a more favorable deflection ratio, among other benefits. ## Claims ### Claim 1 A sensor device comprising: a substrate; a plurality of support elements spaced apart from each other, wherein each of the support elements has a first end arranged on the substrate and is cylindrically shaped; a moveable element supported on second ends of each of the plurality of support elements, and spaced apart from the substrate by the plurality of support elements, the second ends of the plurality of support elements being opposite the respective first ends; and a plurality of sensors, each of the plurality of sensors comprising a second plurality of support elements and a portion of the moveable element supported on the second plurality of support elements, wherein the moveable element, the substrate and the plurality of support elements define a cavity into which the moveable element can deflect in response to a physical quantity to be sensed by the sensor device. ### Claim 2 (depends on 1) The sensor device of claim 1, wherein the moveable element comprises a membrane or a lamella. ### Claim 3 (depends on 2) The sensor device of claim 2, wherein the moveable element comprises silicon or polycrystalline silicon. ### Claim 4 (depends on 1) The sensor device of claim 1, wherein the sensor device comprises a pressure sensor device, and wherein the physical quantity to be sensed is pressure. ### Claim 5 (depends on 4) The sensor device of claim 4, wherein the pressure is sensed by sensing a capacitance between the moveable element and the substrate. ### Claim 6 (depends on 1) The sensor device of claim 1, wherein the plurality of support elements comprise punctiform structures. ### Claim 7 (depends on 6) The sensor device of claim 6, wherein a diameter of a punctiform structure is less than about 3,000 nanometers (nm). ### Claim 8 (depends on 7) The sensor device of claim 7, wherein the punctiform structure has a diameter of about 1,000 nm. ### Claim 9 (depends on 1) The sensor device of claim 1, wherein adjacent ones of the plurality of sensors have at least one of the second plurality of support elements in common. ### Claim 10 (depends on 1) The sensor device of claim 1, wherein a ratio of maximum deflection of the moveable element to average deflection of the moveable element is less than about 2. ### Claim 11 (depends on 1) The sensor device of claim 1, wherein the moveable element and the plurality of support elements are integrally formed with one another. ### Claim 12 A sensor device comprising: a substrate; a plurality of support elements spaced apart from each other, wherein each of the support elements has a first end arranged on the substrate, a circumferential top surface, a circumferential bottom surface, and a single concave radial side wall between the circumferential top surface and the circumferential bottom surface; and a moveable element supported on second ends of each of the plurality of support elements, and spaced apart from the substrate by the plurality of support elements, the second ends of the plurality of support elements being opposite the respective first ends, wherein the moveable element, the substrate and the plurality of support elements define a cavity into which the moveable element can deflect in response to a physical quantity to be sensed by the sensor device. ### Claim 13 (depends on 12) The sensor device of claim 12, wherein a height of the plurality of support elements is approximately equal to a radius of the single concave radial side wall. ### Claim 14 (depends on 12) The sensor device of claim 12, wherein the single concave radial side wall comprises a first portion having a first radius and a second portion having a second radius different from the first radius. ### Claim 15 (depends on 12) The sensor device of claim 12, wherein a diameter of each of the plurality of support elements is less than about 3,000 nanometers (nm). ### Claim 16 A method comprising: providing a substrate; providing a moveable element supported on the substrate by second ends of each of a plurality of support elements spaced apart from each another, each of the plurality of support elements having a first end arranged on the substrate, a circumferential top surface, a circumferential bottom surface, the second end, and a single concave radial side wall between the circumferential top surface and the circumferential bottom surface, wherein the moveable element is spaced apart from the substrate by the plurality of support elements, and the second ends of the plurality of support elements are opposite the respective first ends; and sensing a physical quantity by a deflection of the moveable element toward the substrate into a cavity defined by the substrate, the moveable element and the plurality of support elements. ### Claim 17 (depends on 16) The method of claim 16, wherein the single side wall is radially concave. ### Claim 18 (depends on 16) The method of claim 16, wherein for each of the plurality of support elements a distance to an adjacent one of the plurality of support elements is in a range of about 2 micrometers (μm) to about 20 μm. ### Claim 19 (depends on 16) The method of claim 16, wherein the moveable element comprises a silicon layer.