# US 9,752,764 B2 · Wide-angle emitting LED driven by built-in power and assembly method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,752,764 B2 - Document ID: US9752764B2 - Status: Granted - Kind: B2 - Application number: 14/315,343 - Filed: 2014-06-26 - Published: 2015-12-10 - Granted: 2017-09-05 - Earliest claimed: 2014-06-04 - Assignees: Ningbo Yamao Lighting Electric Appliance Company Ltd. - Applicants: Ningbo Yamao Lighting Electric Appliance Company Ltd. - Inventors: MaoJun Cao; Hui Chen; Wei Tan - Web page: https://patentgrep.com/patent/US9752764B2 ## CPC - F21V 23/005: {the substrate is supporting also the light source} - H05K 1/00: Printed circuits - H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)} - H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass} - H10H 20/8512: {Wavelength conversion materials} - F21Y 2103/33: annular - F21Y 2115/10: Light-emitting diodes [LED] - H05K 1/181: associated with surface mounted components - H05K 3/346: Solder materials or compositions specially adapted therefor - H05K 2201/0108: Transparent - H05K 2201/10106: Light emitting diode [LED] - H10W 90/00: Package configurations - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A wide-angle emitting LED driven by built-in power and an assembling method are provided. The wide-angle emitting LED includes a transparent substrate, at least one light-emitting chip, and a driving circuit component. The front of the transparent substrate is provided with a printed circuit where a portion of an upper surface of the transparent substrate is provided with a plurality of conductive bonding pads. Each of the at least one light-emitting chip is bonded on the front of the transparent substrate, and the at least one light-emitting chip is electrically connected to the conductive bonding pads by metal wires. In addition, the driving circuit component is bonded with the transparent substrate and the conductive bonding pads and is electrically connected to the conductive bonding pads by metal wires. ## Claims ### Claim 1 A wide-angle emitting LED, comprising: a transparent substrate, a front of the transparent substrate is provided with a printed circuit where a portion of an upper surface of the transparent substrate is provided with a plurality of conductive bonding pads; at least one light-emitting chip, wherein each light-emitting chip of the at least one light-emitting chip is bonded with the front of the transparent substrate, and wherein the light-emitting chip being electrically connected to the conductive bonding pads by metal wires; and a driving circuit component bonded with the transparent substrate and the conductive bonding pads, wherein the driving circuit component is electrically connected to the conductive bonding pads by metal wires; the bonding of the each light-emitting chip of the at least one light-emitting chip with the front of the transparent substrate by transparent solid crystal glue and the electrical connection of the each light-emitting chip of the at least one light-emitting chip to the conductive bonding pads and the bonding of the driving circuit component with the transparent substrate and the conductive bonding pads regulating a location of the driving circuit component and the each light-emitting chip of the at least one light-emitting chip and enhancing an adhesive strength of the driving circuit component and the each light-emitting chip of the at least one light-emitting chip; wherein each light emitting chip of the at least one light-emitting chip is transparent and both the printed circuit and the conductive bonding pads are made of transparent conductive materials and the printed circuit is provided with a plurality of fractures and each light-emitting chip of the at least one light-emitting chips is fixed on a respective fracture of the plurality of fractures of the transparent substrate. ### Claim 2 (depends on 1) The wide-angle emitting LED of claim 1, wherein the transparent substrate is a transparent alumina ceramic substrate formed by baking α-Al2O3. ### Claim 3 (depends on 1) The wide-angle emitting LED of claim 1, wherein a transparent high-temperature resisting glue covers the printed circuit, and the transparent high-temperature resisting glue does not cover an upper surface of the conductive bonding pads. ### Claim 4 (depends on 1) The wide-angle emitting LED of claim 1, wherein the driving circuit component comprises a driving IC chip, a rectifier diode chip and resistances. ### Claim 5 (depends on 4) The wide-angle emitting LED of claim 4, wherein the rectifier diode chip and the resistances is bonded with the conductive bonding pads by solid crystal solder paste, and the driving IC chip is bonded with the transparent substrate by solid crystal solder paste. ### Claim 6 (depends on 1) The wide-angle emitting LED of claim 1, wherein the at least one light-emitting chip is selected from a group consisting of a red-ray emitting LED chip, a green-ray emitting LED chip, a blue-ray emitting LED chip, and combinations thereof, and wherein each light-emitting chip is a transparent chip of the at least one light-emitting chip without reflecting layers. ### Claim 7 (depends on 1) The wide-angle emitting LED of claim 1, wherein the front and a back of the transparent substrate are coated with rare earth fluorescent silica gel for packaging, wherein the rare earth fluorescent silica gel for packaging overlaps each light-emitting chip of the at least one light-emitting chip, and wherein the rare earth fluorescent silica gel for packaging on the front of the transparent substrate covers a top of each light-emitting chip of the at least one light-emitting chip, and a top of the driving circuit component is coated with white IC silica gel for packaging. ### Claim 8 (depends on 7) The wide-angle emitting LED as disclosed in claim 7, wherein the rare earth fluorescent silica gel for packaging is comprised of red-colored substance comprising rare earth elements, green-colored substance comprising rare earth elements and silica gel; and a mixing ratio of the red-colored substance, the green-colored substance and the silica gel is 1:4:20.