# US 9,752,734 B2 · Light emitting device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,752,734 B2 - Document ID: US9752734B2 - Status: Granted - Kind: B2 - Application number: 15/231,735 - Filed: 2016-08-08 - Published: 2016-12-01 - Granted: 2017-09-05 - Earliest claimed: 2005-12-16 - Assignees: Nichia Corporation - Applicants: Nichia Corporation - Inventors: Yuichiro Tanda; Toshio Matsushita - Web page: https://patentgrep.com/patent/US9752734B2 ## CPC - F21K 9/232: specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb - F21K 9/235: Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps (F21K9/238 takes precedence) - F21V 3/02: characterised by the shape - F21V 9/30: Elements containing photoluminescent material distinct from or spaced from the light source (shades F21V1/17; globes, bowls or cover glasses F21V3/08, F21V3/12; refractors F21V5/10; reflectors F21V7/26, F21V7/30; elements with provision for controlling the spectral properties or intensity F21V9/40) - F21V 9/32: characterised by the arrangement of the photoluminescent material - F21V 9/38: Combination of two or more photoluminescent elements of different materials - F21V 13/14: the elements being filters or photoluminescent elements, reflectors and refractors - F21V 19/006: {of point-like light sources, e.g. incandescent or halogen lamps, with screw-threaded or bayonet base (of sources having contact pins, wires or blades F21V19/0005; of LEDs or sources mounted on printed-circuit board F21V19/001)} - F21V 29/70: characterised by passive heat-dissipating elements, e.g. heat-sinks - F21V 31/005: {Sealing arrangements therefor} - H05B 33/04: Sealing arrangements {, e.g. against humidity} - H10H 20/8511: {characterised by their material, e.g. binder} - H10H 20/8516: {having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient} - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 90/00: Package configurations - F21Y 2101/00: Point-like light sources - F21Y 2109/00: Light sources with light-generating elements disposed on transparent or translucent supports or substrates - F21Y 2115/10: Light-emitting diodes [LED] - F21Y 2115/30: Semiconductor lasers - H10H 20/8514: {characterised by their shape, e.g. plate or foil} - H10H 20/8515: {not being in contact with the bodies} - H10H 20/853: characterised by their shape - H10W 72/5366: {the bond wires having kinks} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED ## Abstract A light emitting device includes a board, light emitting element chips, a wavelength conversion member, a transparent bulb, support leads, and a support base. The board has a first surface and a second surface. The second surface is an opposite side to the first surface. The light emitting element chips are mounted on the first surface side. The wavelength conversion member is formed unitarily with a transparent member. The transparent bulb encloses the board and the light emitting element chips. The support leads secure the light emitting element chips inside the transparent bulb. The support base can be threadedly engaged with a conventional light bulb socket along a socket axis. The wavelength conversion member is provided on a first surface side and a second surface side, and is elongated in a longitudinal direction. The light emitting element chips is aligned along a line that extends in the longitudinal direction. ## Claims ### Claim 1 A light emitting device comprising: a board having end portions and a center portion therebetween in a longitudinal direction, the board having a first surface on a first surface side thereof and a second surface on a second surface side thereof, the second surface being an opposite side to the first surface, the first surface including a first region and a second region, the first region extending from the center portion of the board to one of the end portions, the second region extending from the center portion of the board to the other of the end portions; a plurality of light emitting element chips mounted on the first surface side of the board; a wavelength conversion member formed unitarily with a transparent member that seals the plurality of light emitting element chips; a transparent bulb that encloses the board and the plurality of light emitting element chips; support leads that secure the plurality of light emitting element chips inside the transparent bulb; a support base that can be threadedly engaged with a conventional light bulb socket along a socket axis; and a pair of metal plates protruding at both ends of the wavelength conversion member, wherein the wavelength conversion member is provided on the first surface side and the second surface side, the wavelength conversion member is elongated in the longitudinal direction when viewed in plan view of the first surface side of the board, wherein a first set of the light emitting element chips are mounted on the first region and arranged from the center portion of the board to the one of the end portions, wherein a second set of the light emitting element chips are mounted on the second region and arranged from the center portion of the board to the other one of the end portions, and wherein the pair of metal plates are electrically connected with the support base via the support leads. ### Claim 2 (depends on 1) The light emitting device according to claim 1, wherein the transparent bulb forms a cylindrical shape. ### Claim 3 (depends on 1) The light emitting device according to claim 1, wherein the transparent bulb is made of glass. ### Claim 4 (depends on 1) The light emitting device according to claim 1, wherein each of the metal plates crosses the support lead. ### Claim 5 (depends on 1) The light emitting device according to claim 1, wherein the pair of support leads is elongated tapering toward the base to conform with a figure of the bulb. ### Claim 6 (depends on 1) The light emitting device according to claim 1, wherein the wavelength conversion member comprises a phosphor therein. ### Claim 7 (depends on 6) The light emitting device according to claim 6, wherein the phosphor comprises a YAG group phosphor. ### Claim 8 (depends on 6) The light emitting device according to claim 6, wherein the phosphor comprises CaSi2O2N2:Eu or SrSi2O2N2:Eu. ### Claim 9 (depends on 6) The light emitting device according to claim 6, wherein the phosphor comprises (Sr,Ca)5(PO4)3Cl:Eu. ### Claim 10 (depends on 6) The light emitting device according to claim 6, wherein the phosphor comprises (Ca,Sr)2Si5N8:Eu. ### Claim 11 (depends on 6) The light emitting device according to claim 6, wherein an average particle size of the phosphor is 3 μm or more. ### Claim 12 (depends on 1) The light emitting device according to claim 1, wherein the plurality of light emitting element chips is electrically connected in series. ### Claim 13 (depends on 1) The light emitting device according to claim 1, wherein the plurality of light emitting element chips is so configured that a main peak light emission wavelength of the light emitting element is varied within a range between 420 nm and 490 nm. ### Claim 14 (depends on 1) The light emitting device according to claim 1, wherein each of the light emitting element chips comprises nitride semiconductor made of InxAlyGa1-x-yN (0≦x, 0≦y, x+y≦1). ### Claim 15 (depends on 1) The light emitting device according to claim 1, wherein the wavelength conversion member substantially surrounds the board. ### Claim 16 (depends on 15) The light emitting device according to claim 15, wherein the wavelength conversion member opens opposing sides of the board. ### Claim 17 (depends on 1) The light emitting device according to claim 1, wherein the board is configured to be transparent so that a light emitted from the plurality of light emitting element chips on the first surface side of the board forwards outside of the light emitting device through the second surface of the board. ### Claim 18 (depends on 1) The light emitting device according to claim 1, wherein the wavelength conversion member is capable of converting light emitted from the plurality of light emitting element chips into light with a different wavelength such that the converted light with the different wavelength is radiated along a first direction from the first surface side of the board to an outer periphery of the wavelength conversion member, and along a second direction from the second surface of the board to the outer periphery of the wavelength conversion member. ### Claim 19 (depends on 1) The light emitting device according to claim 1, wherein all light emitting element chips mounted on the first surface side of the board are aligned along a line. ### Claim 20 (depends on 1) The light emitting device according to claim 1, wherein the wavelength conversion member seals all light emitting element chips mounted on the first surface side of the board. ### Claim 21 (depends on 19) The light emitting device according to claim 19, wherein the wavelength conversion member seals all light emitting element chips mounted on the first surface side of the board. ### Claim 22 (depends on 1) The light emitting device according to claim 1, wherein the first set of light emitting element chips and the second set of light emitting element chips are aligned along substantially a single line that extends in the longitudinal direction of the wavelength conversion member. ### Claim 23 (depends on 1) The light emitting device according to claim 1, wherein the support leads extend from the support base towards the pair of metal plates. ### Claim 24 (depends on 1) The light emitting device according to claim 1, wherein one of the support leads is positioned between one of the metal plates and the support base. ### Claim 25 (depends on 1) The light emitting device according to claim 1, wherein all of the light emitting element chips mounted on the first surface side of the board are aligned along a single line when viewed in plan view of the first surface side of the board. ### Claim 26 A light emitting device comprising: a board having end portions and a center portion therebetween in a longitudinal direction, the board having a first surface on a first surface side thereof and a second surface on a second surface side thereof, the second surface being an opposite side to the first surface, the first surface including a first region and a second region, the first region extending from the center portion of the board to one of the end portions, the second region extending from the center portion of the board to the other of the end portions; a plurality of light emitting element chips mounted on the first surface side of the board; a wavelength conversion member formed unitarily with a transparent member that seals the plurality of light emitting element chips; a transparent bulb that encloses the board and the plurality of light emitting element chips; support leads that secure the plurality of light emitting element chips inside the transparent bulb; a support base that can be threadedly engaged with a conventional light bulb socket along a socket axis; and a pair of metal plates protruding at both ends of the wavelength conversion member, wherein the wavelength conversion member is provided on the first surface side and the second surface side, the wavelength conversion member is elongated in the longitudinal direction when viewed in plan view of the first surface side of the board, wherein a first set of the light emitting element chips are mounted on the first region and arranged from the center portion of the board to the one of the end portions, wherein a second set of the light emitting element chips are mounted on the second region and arranged from the center portion of the board to the other one of the end portions, and wherein the support leads extend from the support base towards the pair of metal plates. ### Claim 27 A light emitting device comprising: a board having end portions and a center portion therebetween in a longitudinal direction, the board having a first surface on a first surface side thereof and a second surface on a second surface side thereof, the second surface being an opposite side to the first surface, the first surface including a first region and a second region, the first region extending from the center portion of the board to one of the end portions, the second region extending from the center portion of the board to the other of the end portions; a plurality of light emitting element chips mounted on the first surface side of the board; a wavelength conversion member formed unitarily with a transparent member that seals the plurality of light emitting element chips; a transparent bulb that encloses the board and the plurality of light emitting element chips; support leads that secure the plurality of light emitting element chips inside the transparent bulb; a support base that can be threadedly engaged with a conventional light bulb socket along a socket axis; and a pair of metal plates protruding at both ends of the wavelength conversion member, wherein the wavelength conversion member is provided on the first surface side and the second surface side, the wavelength conversion member is elongated in the longitudinal direction when viewed in plan view of the first surface side of the board, wherein a first set of the light emitting element chips are mounted on the first region and arranged from the center portion of the board to the one of the end portions, wherein a second set of the light emitting element chips are mounted on the second region and arranged from the center portion of the board to the other one of the end portions, and wherein one of the support leads is positioned between one of the metal plates and the support base.