# US 9,752,590 B2 · Two pump design with coplanar interface surface

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- Number: US 9,752,590 B2
- Document ID: US9752590B2
- Status: Granted
- Kind: B2
- Application number: 14/175,090
- Filed: 2014-02-07
- Published: 2014-09-18
- Granted: 2017-09-05
- Earliest claimed: 2013-03-13
- Assignees: GHSP, Inc.
- Applicants: GHSP, Inc.
- Inventors: Ryan Rosinski
- Web page: https://patentgrep.com/patent/US9752590B2

## CPC

- F04D 29/426: {especially adapted for liquid pumps}
- F04D 13/14: the pumps being all of centrifugal type {(deviation valves F04D15/0016)}
- Y10T 29/49236: Fluid pump or compressor making
- F04D: NON-POSITIVE-DISPLACEMENT PUMPS (engine fuel-injection pumps F02M; ion pumps H01J41/12; electrodynamic pumps H02K44/02)
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A multi-pump apparatus includes a first component in a fluid heat transfer system, such as a heat exchanger, the first component including a body portion forming a first interface surface. A pumping component includes a second interface surface. The first and second interface surfaces are planar and combine to define two pump cavities and a planar interface groove supporting a seal ring that extends around the two pump cavities to prevent leakage of fluid from the pump cavities. The pumping component includes a pump impeller in each of the pump cavities and independently-controlled separate motors driving the two pump impellers using an on-board circuit board. One of the first and second components also defines a fluid inlet to and a fluid outlet from each of the pump cavities. Related methods are also defined.

## Claims

### Claim 1

A cooling system, comprising:
separate first and second heat transfer systems each including heat transfer components; and a dual pump apparatus having a first pump connected to the first heat transfer system for pumping fluid through the first heat transfer system, and having a second pump connected to the second heat transfer system for pumping fluid through the second heat transfer system;
the dual pump apparatus, comprising:
a housing body supporting first and second motors;
a second component including a body portion, the second component being one of a fluid reservoir and a heat exchanger component;
the housing body and the second component including interfacing surfaces that combine to define adjacent separate pump cavities, a fluid inlet and a fluid outlet to each of the separate pump cavities, and an interface groove that extends continuously around the adjacent separate pump cavities; and
first and second impellers connected to the first and second motors, respectively, and located in the separate pump cavities, the first impeller and first motor forming the first pump and the second impeller and second motor forming the second pump;
wherein the second component is integrally formed into a wall of a heat exchanger in the first heat transfer system.

### Claim 2 (depends on 1)

The cooling system of claim 1, including:
an on-board control circuit board attached to the pumping component and electrically connected to the first and second motors for controlling independent operation of the first and second motors and hence controlling independent operation of the first and second impellers in the first and second cavities, respectively.

### Claim 3 (depends on 1)

The cooling system of claim 1, wherein the wall includes side surfaces defining part of each of the adjacent separate pump cavities.

### Claim 4 (depends on 1)

The cooling system of claim 1, wherein the housing body is molded, and wherein the first and second motors include first and second stators, respectively, that are insert molded into the housing body.

### Claim 5 (depends on 1)

The cooling system of claim 1, wherein the interface groove is planar.